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The PC offers expansion options through PCI Express, M.2, Mini-PCIe slots, and expansion modules for use in...
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COSEL released the MH3 series of high isolation DC/DC converters, targeting medical and industrial applications.
Swissbit announced the launch of CFexpress 2.0 Type B cards. The cards feature high reliability, performance, and data protection.
Vishay Intertechnology introduced the 125 ALS and 126 ALX, two new series of miniature axial aluminum electrolytic capacitors.
SensiML announced its SensiML Analytics Toolkit is now integrated with Google’s TensorFlow Lite for Microcontrollers.
Initial orders for devices and testing cartridges which will be delivered to potential launch customers in September and October 2020
Silex Insight, and Faraday Technology Corporation announce their collaboration for delivering secure IoT solutions for a wide range of ASIC applications.
Texas Instruments released a custom version of the PSpice® simulator from Cadence Design Systems, enabling engineers the ability to simulate complex analog circuits.
MachXO3LF and MachXO3D FPGAs Support Extended Temperature Range for Automotive and other Ruggedized Applications
A recent report from Ber Insight, an IoT market research firm, show that IoT managed service providers have more than 50 million IoT subscribers worldwide.
Rohde & Schwarz announced the release of the R&S FSW-B8001, an option that extends the internal analysis bandwidth of the R&S FSW high-end signal and spectrum analyzer to 8.3 GHz.
Neurala, a vision AI software company, announced the launch of the Neurala VIA Authorized Partner program. The program aims to help manufacturers leverage vision AI to improve quality inspection.
Xilinx announced the release of the T1 Telco Accelerator card for O-RAN distributed units (O-DUs) and virtual baseband units (vBBUs) in 5G networks.
Microchip Technology announced a partnership with Cartesiam, Edge Impulse, and Motion Gestures to simplify ML implementation at the edge.
MASS will provide automotive OEMs and their suppliers with end-to-end connectivity solutions for the growing number of cameras, sensors, and displays that enable automotive applications.
Free online tool allows supply chain professionals to view and purchase instant offers on over 550 million MPN offers from 2,600+ vendors from around the world.
The noise suppression component will be inserted in signal lines for electronic control circuits in automotive applications including car audio, navigation, and battery monitoring systems. Signal
Through the partnership, Siemens’ PAVE360 platform will be used to create digital twin simulations for the validation and testing of all processors, electronics, sensors, and systems.
According to Semico’s Inflection Point Indicator (IPI) Report, semiconductor revenues fell 8.0% from June to July, but are still on pace for 3.3% growth in 2020.
IAR Systems announced updates of its IAR Embedded Workbench for Arm. The update includes complete coverage for the ultra-low-power Renesas RE microcontroller (MCU) Family.
The EVG 7200 system with SmartNIL technology is ideally suited for volume production of next-generation photonic devices including waveguides and DOEs, for applications such as AR and virtual reality.