First-Quarter 2020 Global Semiconductor Equipment Billings Up 13% Year-Over-Year

June 2, 2020 Tiera Oliver

In its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report, SEMI announced worldwide semiconductor manufacturing equipment billings contracted 13% to US$15.57 billion quarter-over-quarter in Q1 2020 but increased 13% year-over-year.

The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 80 global equipment companies that provide data on a monthly basis. The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter and year-over-year change by region are as follows:

Source: SEMI ( and  SEAJ (, June 2020

Source: SEMI ( and  SEAJ (, June 2020

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

  • Monthly SEMI Billings Report, a perspective on equipment market trends
  • Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
  • SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market.

For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at More information is also available online.

About the Author

Tiera Oliver, edtorial intern for Embedded Computing Design, is responsible for web content edits as well as newsletter updates. She also assists in news content as far as constructing and editing stories. Before interning for ECD, Tiera had recently graduated from Northern Arizona University where she received her B.A. in journalism and political science and worked as a news reporter for the university's student led newspaper, The Lumberjack.

Follow on Twitter Follow on Linkedin Visit Website More Content by Tiera Oliver
Previous Article
RunSafe Alkemist Now Protects Yocto Builds from Memory Exploits

Alkemist uses a procedure called load-time function randomization (LFR), which restacks functions in memory...

Next Article
KEMET Extends KC-LINK Range Using KONNEKT High-Density Packaging Technology
KEMET Extends KC-LINK Range Using KONNEKT High-Density Packaging Technology

Designed for use by power electronics engineers where high-power density and high efficiency in a small for...