Efficient Power Conversion (EPC) announced the availability of their enhancement-mode gallium nitride (GaN) devices in wafer form, to allow for easier integration in customer power system sub-assemblies, reducing device interconnect inductances, and the interstitial space needed on the PCB.
“We have listened to our partners and are pleased to offer our industry-leading GaN products in wafer form that can accommodate a variety of assembly techniques and applications,” said Alex Lidow, CEO and co-founder of EPC.
EPC is offering eGaN power devices in wafer form either with or without solder bumps. Extra services such as wafer thinning, metallization of the wafer backside, and application of backside coating tape are also available.
Learn more at www.epc-co.com/epc/Products/WaferSales.aspx.