IoT
- IoT
- What's New
- Semantic Interoperability
- The IoT Defined
- Node.js
Industrial
Machine Learning
Power Electronics
Automotive
Security
MakerPro
Processing
Dev Tools & OS
Networking
Storage
Dev Kit Selector
Podcasts
Webcasts
White Papers
Upcoming Activities & Events
Embedded Executive

Home » News » Boston Semi Equipment Introduces Handling of Multi-Port, Low-Pressure MEMS Sensors

× Share this Article

Twitter
Email
LinkedIn

Boston Semi Equipment Introduces Handling of Multi-Port, Low-Pressure MEMS Sensors

November 14, 2019 Tiera Oliver

Share this Article
Twitter
Email
LinkedIn

Boston Semi Equipment (BSE) announced that it has enhanced its Zeus gravity feed handlers with the capability of handling extremely low-pressure MEMS devices with multiple ports.

The Zeus pressure MEMS stimuli include 0 to 18 inches of H2O, 0 – 3 psia vacuum, and up to 150 psi. A 70-bar stimulus is in development. The Zeus is a tri-temperature handler that can be configured with up to eight test sites. Cold temperature testing is achieved using LN2 or a BSE-designed, two-stage chiller, the MR2.

For more information, please visit: www.bostonsemiequipment.com

About the Author

Tiera Oliver, edtorial intern for Embedded Computing Design, is responsible for web content edits as well as newsletter updates. She also assists in news content as far as constructing and editing stories. Before interning for ECD, Tiera had recently graduated from Northern Arizona University where she received her B.A. in journalism and political science and worked as a news reporter for the university's student led newspaper, The Lumberjack.
Follow on Twitter Follow on Linkedin Visit Website More Content by Tiera Oliver

KIOXIA America Introduces 512GB Automotive UFS

The 512GB device joins the company’s existing lineup of Automotive UFS, which includes capacities of 16GB, ...

Actinius Cellular IoT Prototyping Platform Compatible with Adafruit FeatherWing

The Icarus IoT board helps developers get cellular IoT prototypes and demos up and running quickly

Most Recent Articles

RTI and SoC-e Partnership Announce New Partnership, Enhance Communications Performance Optimization

Boston Semi Equipment Introduces Handling of Multi-Port, Low-Pressure MEMS Sensors

About the Author

Previous Article

Next Article

Most Recent Articles

The companies will provide Data Distribution Service (DDS) and TSN solutions for those seeking communications performance optimization over distributed systems.

On Semiconductor released a Bluetooth Low Energy mesh networking solution based on the company’s ultra-low-power RSL10 System-in-Package (RSL10 SIP).

Applitools announced its Visual AI technology has surpassed one billion images analyzed since launching commercially and is projected to double year over year.

Olea Edge Analytics released its EdgeWorks Platform 2.0, which combines blockchain, AI, and machine learning technologies to provide advanced solutions for water billing, delivery, and conservation.

The new family targets a broad range of application from automated industrial equipment to system management in communications infrastructures.

Jumpstarts new-application design for industrial and smart-building markets.

Under terms of the agreement, both organizations will promote their respective platform capabilities throughout the manufacturing industry.

At the International Supercomputing Conference (ISC) it was announced that the Fugaku supercomputer was awarded the number one spot of the TOP500 list.

Xilinx released two new real-time computing video appliances for easy-to-use, ultra-high-density video transcoding applications.

Lattice Semiconductor announced the availability of the Lattice Radiant 2.1, a software design tool for FPGAs.

MYIR provides FZ3 Kit as a development kit, it contains the FZ3 Card and necessary accessories including one 12V/2A power adaptor, one 16GB TF card, one mini USB cable, and one mini DP to HDMI cables

Optimized development environment and tools are available for creating advanced applications with multiple POSIX processes targeting the MPPA Coolidge.

SLX FPGA 2020.2 includes a Vivado HLS project importer to get started with an existing Xilinx HLS project.

Ideal for challenging high-temperature applications including industrial, medical, and solar.

Aldec now offers the complete and customizable qualification package for the Basic Tool Qualification process.

Marvin Test Solutions released the GX3788 High-Performance FPGA Multi-Function Instrument which combines A/D, D/A, and digital I/O functionality.

In a May 2020 report, NCC outlined the issues that were found and detailed how the Zephyr Project Security Committee was working to fix the issues.

MediaTek released the Helio G25 and G35, the company’s newest chips in the smartphone gaming-focused G series.

Features are available now in Intel's DPC++ & Codeplay's ComputeCpp; developers encouraged to provide feedback on the publicly available specification for C++ based heterogeneous parallel programming.

Light metal TECs for heavy heat load, TECs with more than 100W of cooling capacity.