IoT Device Security Conference
IoT
- IoT
- What's New
- Semantic Interoperability
- The IoT Defined
- Node.js
Industrial
Machine Learning
Power Electronics
Automotive
Security
MakerPro
Processing
Dev Tools & OS
Networking
Storage
Virtual Events
White Papers
Podcasts
Dev Kit Selector

Home » News » Adesto to Appear at Electronica Following S3 Semiconductors and Echelon Corporation Acquisitions

× Share this Article

Twitter
Email
LinkedIn

Adesto to Appear at Electronica Following S3 Semiconductors and Echelon Corporation Acquisitions

November 12, 2018 Laura Dolan

Share this Article
Twitter
Email
LinkedIn

Adesto Technologies will have its latest technology developments on display at Electronica in Hall C3, Booth 121, Messe München, Germany from November 13-16.

Adesto will present a variety of solutions following its recent acquisitions of S3 Semiconductors and Echelon Corporation, all targeting IoT edge and communication gateway systems.

The following products will be available:

The SmartEdge platform
The Octal EcoXiP, Adesto’s newest Non-Volatile Memory (NVM)
The new SmartServer IoT edge server
The latest PowerLine Communications solutions

Visit www.adestotech.com for more information.

Samtec’s New Products, New Technologies At Electronica

Samtec will be revealing some new products and new technologies at Electronica 2018.

Micross Will Present Microelectronic Products & Services at Electronica 2018

Micross to Showcase Hi-Rel Microelectronic Products & Services at Electronica 2018 in Munich.

Most Recent Articles

ACEINNA Releases OpenIMU ROS Driver for Robotic Applications

Adesto to Appear at Electronica Following S3 Semiconductors and Echelon Corporation Acquisitions

Previous Article

Next Article

Most Recent Articles

ACEINNA released the ACEINNA OpenIMU ROS Driver for developers of robotic applications.

Microchip Technology announced the release of the Icicle Development Kit for PolarFire (SoC) FPGAs, what they are calling the first RISC-V-based SoC FPGA development kit.

The new suite of IP includes the Arm Cortex-A78AE CPU, Arm MaliTM-G78AE GPU, and Arm Mali-C71AE ISP, with supporting software, tools, and system IP to enable silicon providers and OEMs.

MagnaChip Semiconductor released two new LED Driver ICs for UHD TV BLU (back light unit). The models are 1- and 2-channel units that were developed for mid-range UHD TVs.

Western Digital announced the expansion of its WD Purple storage solutions family with the addition of its 18TB surveillance HDD and the 1TB WD Purple SC QD101 microSD card.

Power Integrations announced the release of the LYT6078C, the company’s newest product within the LYTSwitch™-6 family of safety-isolated LED drivers for smart lighting applications.

The language mapping specification will provide data distribution service (DDS) and CORBA users with interoperable API for C++ programming language.

VOLANSYS launched the IoTPAD program, which provides qualifying participants eligibility to take advantage of the company’s gateway and loud platforms at zero cost.

ADLINK released the cExpress-TL, its newest generation COM Express Type 6 module. The module is based on the 11th Gen Intel Core i7/i5/i3 and Celeron processor.

N.A.T, a supplier of embedded boards and systems based on open standards, release new software defined radio (SDR) products for wireless network developers.

Vishay announced the extension of its TNPW e3 series of automotive grade, high stability thin film flat chip resistors.

Li Auto will be the first OEM to use the powerful NVIDIA Orin system-on-a-chip (“SoC”) in its full-size extended-range electric vehicles to be launched in 2022.

ON Semiconductor and SUBARU redefine ADAS capability with new machine vision algorithms and sensing technology.

GUI toolkit for Linux enhances 32-bit microprocessor capabilities for low- and mid-range- resolution graphical displays.

Continental’s ARS540 is a premium, long-range 4D imaging radar with high resolution and 300-meter range.

OnLogic announced a partnership with AMD, allowing consumers access to a new line of industrial servers that are powered by the two company’s processors, AMD Ryzen and AMD EPYC.

Combining IMG iEB110 hardware with Packetcraft Bluetooth host stack to deliver a complete Bluetooth Low Energy IP solution.

Mixel's IP supports high-performance imaging and display applications

congatec fuels launch of 11th Gen Intel Core processors with two new design options

Industrial grade, 15 meters cable support, Full HD with built-in HDR, GMSL2, and deserializer interface board for NVIDIA Jetson AGX Xavier Developer Kit