The Power Stamp Alliance (PSA), which is creating collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters, today announced a software user interface that can be used with any compatible power stamps. This is the first time that a power industry alliance has created a graphical user interface (GUI) that developers can use with products from any member company. The PSA Power Stamp GUI can be used with any of the PSA main power stamps that incorporate the PMBus protocol.
PSA 48V direct conversion DC-DC modules - or ‘power stamps’ - primarily target high-performance computers and servers being used in large data centers, many of which follow the principles of the Open Compute Project (OCP). The Power Stamp Alliance will be represented at the OCP Summit 2019 by its Founding Members, Artesyn Embedded Technologies, Bel Power Solutions, Flex, and STMicroelectronics.
The new GUI provides power engineers with a simple and functionally powerful user interface that delivers control flexibility over their digitally-controlled power stamp products. The PSA Power Stamp GUI is compatible with Windows operating systems and enables the configuration of PSA-compliant products and solutions through a USB to PMBus dongle adapter.
The user interface is intuitive and starts with an overview of the power stamp units' general status with warnings and faults displayed if appropriate. Users can observe simple telemetry and issue basic ON/OFF and sequencing commands. Detailed telemetry is also accessible through a dedicated button in the GUI. Users can also upload and download configuration files from the main unit as per the PSA-member’s user guidelines. Output voltage configuration covers set-point definition, saturation and offset functions. Advanced controls allow the user to configure and adjust protection thresholds and warnings.
By creating and sharing a specification for a standard product footprint and functions, the Power Stamp Alliance has created a multi-vendor ecosystem to assure practical levels of alternate source capability to server and storage system manufacturers, while encouraging a competitive supply chain through differentiation in topology, circuitry, and performance from multiple, independent manufacturers. Formally launched at the Open Compute Project (OCP) Summit in 2018 with the publication of specifications, drawings and pin-out descriptions for main and satellite power stamps, the Alliance has since also published a new Orcad Library and Allegro Footprint Package (Macro) to its website to enable designers to embed Power Stamps into their own schematic, along with the linked Allegro reference footprint for proper layout. The Power Stamp Alliance will be represented at the OCP Summit 2019 by its Founding Members, Artesyn Embedded Technologies, Bel Power Solutions, Flex, and STMicroelectronics.
PSA reference design boards, power stamps and the new GUI are available from PSA member representatives, who can be contacted via the Power Stamp Alliance website www.powerstamp.org/contact/.
About the Power Stamp Alliance
The Power Stamp Alliance has been formed to define a standard product footprint and functions that provide a multiple sourced, standard modular board-mounted solution for power conversion for 48Vin to low-voltage, high-current DC-DC applications. These 48V single-stage, direct-conversion DC-DC modules - or 'power stamps' - primarily target devices being used in large data centers (e.g. high-performance computers, ASICs, and FPGAs), many of which follow the principles of the Open Compute Project (OCP). The Founding Members of the Power Stamp Alliance are Artesyn Embedded Technologies, Bel Power Solutions, Flex, and STMicroelectronics.
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