Pixus Announces New Thick and Rugged Faceplates For Embedded Boards

March 15, 2019 Pixus Technologies

Pixus Technologies, a provider of embedded computing and enclosure solutions, has released new OpenVPX faceplates for rugged applications.

The new 6U OpenVPX panels feature an extra thick extrusion, providing both rigidity and the ability to attach helicoils on the faceplate. There is also a PCB holder bar that extends along the inside of the 0.8” wide panel. This bar acts as a stiffener for the panel and provides a more secure interface for attaching the PCBs. EMC gaskets and the Pixus Type IVs ejector handles with it’s rugged metal engagement claw are optional. Versions in a 3U height or 1.0” width are available upon request.

Pixus offers silkscreen and custom cutout services for its faceplates. The company also provides filler panels, handles, card guides, rails, PCB protective covers, and many other components in various VITA and PICMG based open standard architectures.

About Pixus Technologies

Leveraging over 25 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies' embedded backplanes and systems are focused primarily on ATCA, OpenVPX, MicroTCA, and custom designs. Pixus also has an extensive offering of VME-based and cPCI-based solutions. In May 2011, Pixus Technologies became the sole authorized North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.

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