Experience Pentair at embedded world 2018

February 6, 2018 ECD Staff

At this year's embedded world, from 27.02. to 01.03.2018 in Nuremberg, presents Pentair in the four subject areas "Protection", "High Speed", "Modularity" and "Cooling" Schroff product news and interesting developments for the embedded sector.

The "Protection" topic area focuses on rugged systems and racks. These standard products, based on modular product platforms, are well prepared for a wide variety of mechanical stability requirements such as shock and vibration resistance as well as IP and EMC protection. The highlight is an absolutely dense rugged system that demonstrates its tightness in a water-filled aquarium.

In the "High Speed" section, visitors will find a 100 Gbps Schroff AdvancedTCA backplane that has been developed and verified in accordance with the PICMG 3.1 R3.0 specifications for 100 Gbps Ethernet. Particularly interesting is the modular standard COM carrier solution, which is offered as a complete solution including COM module and carrier in an interscale housing with cooling and power supply. For this COM carrier solution, additional new plug-on modules are now available, such as another power input module with limited voltage range, a post code module for error display during booting, a LVDS module for connecting TFT monitors and a Module for a second Gigabit Ethernet interface.

"Modularity" is another area of ​​interest and the main focus is on the configurable Interscale housing series for standardized and non-standard printed circuit boards with a small form factor. Particularly noteworthy is a new Schroff PXI Express system, based on the Schroff RatiopacPRO Air housing, which is characterized by its modular design and the development of a passive as possible backplane. Separate modules for the necessary PCI bridge, PCIe switch and clock functions allow a very compact design and relatively easy to make adjustments even in small quantities.

To round off the offer, Pentair shows in cooling ready different cooling solutions for housing, system and cabinets. Of particular interest is the cooling solution of the OCP standards-based ServCite rack, which meets the demands of next-generation telecommunications networks for high speed, memory and data processing capacity, robustness and reliability. The cooling is done here by a special rear door with integrated air / water heat exchanger. The heat exchanger is mounted on the inside of the perforated rear door and mounted on a 200 mm deep mounting frame, which is attached to the back of the cabinet. With this solution, cooling capacities of up to 30 KW can be achieved.

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