Press Releases

Embedded computing news related to serving engineers and other industry professionals. Brought to you by OpenSystems Media.

  • VIA Provides Advanced AI Technology to Formosa Sumco Technology (FST)

    FST to leverage VIA Image Recognition and Intelligent Learning algorithms to improve wafer defect identification to 99.9% accuracy.

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  • PICMG COM-HPC committee reaches important milestone

    COM-HPC pinout approved.

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  • AUTERA AutoBox – Developing Automated Driving System Software

    dSPACE introduces new in-vehicle prototyping and data logging system at the dSPACE World Conference

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  • OmniVision Expands Machine Vision Global Shutter Image Sensor Family With New Lightguide-Integrated Sensor for Improved Optical Performance

    VGA Sensor Offers Drop-in Replacement of Widely Deployed OV7251 Family for Machine Vision Applications Requiring Sharpest Captures of Objects in Motion.

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  • Volkswagen Joins SEMI; Membership to Advance Automotive Electronics

    SEMI announced today that leading German vehicle manufacturer Volkswagen AG has joined SEMI.

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  • Bernd Hops to take over as Head of Corporate Communications at Infineon

    From January 2020, Bernd Hops (46), currently Head of External Communications, will take over as Head of Communications and Public Authorities & Associations at Infineon Technologies AG.

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  • New Smart Meter using Adesto’s Memory and Communications Technologies Begins Pilot Program in Africa and Middle East

    Adesto Collaborated with Local Companies SIAME and I@T to Develop New G3-PLC Based Meter.

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  • TE Connectivity’s new 369 shielded connectors expand harsh environment capabilities beyond commercial aerospace

    EMI shielded product extension of current 369 connector family now available.

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  • DataProphet Artificial Intelligence Helps Enable Nexteer Automotive to Drive Advanced Data Decisions

    Machine Learning Solution Implementation Aims to Reduce Scrap and Improve Quality in Mature Data Environment.

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  • Major Brands Join the LoRa Alliance at Leadership Levels Confirming Continued Momentum for LoRaWAN as the Global De Facto LPWAN Standard

    The LoRa Alliance today introduced its new Sponsor and Contributor members who have joined in the past six months.

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  • Award-Winning MultiTech MultiConnect rCell Intelligent Cellular Router and Dragonfly Embedded Modem Now available with LTE Category 4 for

    Latest embedded and device products deliver intelligent connectivity to the smart grid and other utility distribution networks.

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  • SECO Acquires InHand Electronics

    SECO Group acquires 100% of InHand Electronics.

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  • Telit ME910C1-WW and ME910C1-NA LTE-M Modules Certified by U.S. Cellular

    Telit today announced that its ME910C1-WW (World Wide) and ME910C1-NA (North America) modules have been certified by U.S. Cellular for its recently launched LTE-M service.

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  • Sequans and Seong Ji Announce New LTE-M/NB-IoT Module Based on Sequans’ Monarch Technology Now Certified in South Korea

    Seong Ji’s LTM600 module approved to operate on network of LGU+.

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  • New technology for mature applications: CoolSiC™ MOSFET evaluation board for motor drives up to 7.5 kW

    Silicon carbide (SiC) is en route to mainstream for applications like photovoltaic and uninterruptable power supplies.

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  • New Rugged Supercomputing Servers Enable AI, HPC and Sensor Fusion Applications at The Edge

    Latest field-deployable parallel computing subsystems optimize big data workloads for mission-critical platforms.

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  • KP Performance Antennas Releases New Flat Panel TVWS Antenna

    New TVWS Antenna Covers Frequencies from 470-698 MHz to Support 2x2 MIMO Radios.

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  • VadaTech Announces Network Attached Storage Blade with RAID and iSCSI

    VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the ATC605.

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  • Latest Harrier USB/HDMI board delivers more choice for autofocus zoom block camera applications

    Product Launch - Harrier USB/HDMI Camera Interface Board

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  • AbraxSys Announces the Release of a 10.4" Open-Frame Rugged LCD Product Line

    AbraxSys newly released 10.4" XGA model meets a growing demand for industrial grade, higher performance open-frame displays.

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