Press Releases

Embedded computing news related to serving engineers and other industry professionals. Brought to you by OpenSystems Media.

  • SmartDV Speeds Delivery of its New CXL Verification IP

    First Verification IP Available for New Protocol Based on PCIe Infrastructure.

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  • AAEON Partners with Gorilla to Showcase Edge AI Solutions at COMPUTEX Taipei 2019

    IVAR™, developed by Gorilla and utilizing the AIOT-AIVD, will be a part of the AAEON showcase at COMPUTEX Taipei 2019.

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  • 'Best Big Data Analytics & Technology Provider' award goes to McObject

    eXtremeDB® for HPC database management system, was last night announced as 'Best Big Data Analytics & Technology Provider' at the Inside Market Data & Inside Reference Data Awards'.

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  • Clientron debuts its new flexible thin client S810 with innovative Port-on-Foot design to optimize user experience

    Clientron is proud to unveil its new flexible thin client S810, which is based on the latest Intel® Celeron® quad core processor to enable energy-saving and performance improvement.

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  • Total Phase Releases the Advanced Cable Tester v2

    Total Phase has officially released the Advanced Cable Tester v2, a comprehensive testing solution for USB, Apple Lightning, and video cables.

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  • EPIC-KBS9-PUC: Proven Performance for your Embedded Application

    EPIC-KBS9-PUC barebones system provides support and flexibility for a wide range of embedded applications.

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  • TAICENN Cantilever Mount Industrial Monitor ATM-CC150

    As you know, TAICENN has a very strong capability in ODM & Customize service. Our skilled & experienced engineer team is providing professional R&D service, and it is a very flexible and quick support

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  • TAICENN's New TPC-DRM Series Resistive Touch Panel PC

    TAICENN modular 2.0 concept designed, available with various CPU platform, including Baytrail, Apollo lake, 6th/7th-gen Core i3/i5/i7, available now.

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  • Winmate Updates PT-Series HMI Panel PCs with Arm Cortex-A72 + A53 CPU

    Winmate expands the PT-Series multi-touch HMI lineup with the Android arm-based 15.6-inch W15RK3S-PTA3 and 15-inch R15RK3S-PTC3.

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  • BOXER-8150AI: AI at the Speed of Sight

    The BOXER-8150AI powered by NVidia Jetson TX2 features eight USB 3.0 ports providing higher bandwidth for USB cameras and devices.

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  • TYAN Powers AI and HPC with 2nd Gen Intel® Xeon® Scalable Processor-based Server Platforms at ISC 2019

    Thunder HX lineup designed for AI optimization and HPC revolution.

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  • Telco Systems Frees Valuable CPU Resources with Increased Performance Using Hardware Acceleration on Arm-Based SoCs from NXP

    New solution increases packet throughput 3x to 5x and lowers latency when compared to software-accelerate OVS-DPDK data path.

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  • High-performance ARM SoM Powered by NXP i.MX 8M

    Target applications which requires high multi-media performance.

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  • Newark Helps Reduce Time to Market with Modular Facial Recognition Component from Omron

    Newark is now shipping an HVC from Omron Electronic Components.

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  • MultiTech Wins Corporate Award from LoRa Alliance™; Derek Wallace Elected Regional Vice Chair for North America

    Alliance Founding Member Reinforces Commitment to the Future of LoRaWAN® Connectivity for the Internet of Things with Ongoing Innovation and Ecosystem Leadership.

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  • Senet and Radio Bridge Partner to Accelerate IoT Solution Development from Concept to Market

    Integrated LoRaWAN Network Access and Device Provisioning Facilitate Faster Time-to-Market for Solution Developers.

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  • Rutronik and Vishay Intertechnology Extend Franchise Agreement to the Americas

    Rutronik, Inc. is now distributing Vishay’s extensive range of product offerings, including resistor, inductors, capacitors, and more, in the Americas.

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  • Sepio Systems Partners with Distribution Giants Tech Data and SHI to Tackle Hardware-Based Cyber-Attacks

    The partnership will allow Tech Data’s and SHI’s customers to benefit from easy deployment of Sepio Prime and Sepio Agents for managing the security risk coming from uncontrolled peripheral devices.

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  • CONTACT Software presents Collaboration Hub at Daimler EDM CAE Forum

    At this year's EDM CAE Forum, CONTACT Software shows how efficient collaboration across company boundaries can be realized.

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  • Chatsworth Products’ RMR® Industrial Enclosures Are Now Available in Stainless Steel for NEMA Type 4X Applications

    Newest Portfolio Additions Also Include Disconnect Models Covering Several NEMA Type Ratings

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