SIGLENT RF Signal Generators Support 5G, LTE, Bluetooth Application Testing

May 22, 2020 Brandon Lewis

SIGLENT Technologies has released two wide-range RF Signal Generators for application testing,  the SSG5000X and SSG5000X-V Series Generators. The platforms are capable of testing the NR-5G Band (FR1) between 3.4 and 3.7 GHz, and feature a well-designed menu structure that simplifies the creation of complex signal types.

Both signal generators offer a phase noise of -120 dBc (1 GHz / 20 kHz offset), with a maximum output level of +20 dBm (configurable to +26 dBm) and minimum output level of -130 dBm (configurable to -140 dBm). They can source analog and vector signals of 4 GHz (standard) or 6 GHz (upgradeable using a software license key).

SSG5000X-V platforms are intended for use with complex modulated signals and therefore come with built-in support for protocols such as 5G NR, LTE, WLAN, WCDMA, GSM, and Bluetooth. The systems feature a custom mode that enables fast setup of ASK, FSK, PSK and QAM modulation schemes at 120 Msps sampling rates, and provide an arbitrary waveform playback function. They can also generate Additive White Gaussian Noise (AWGN) internally and add it to any signal.

SSG5000X-V devices offer internal IQ modulation and RF modulation bandwidths as high as 150 MHz. With the systems it is possible to output differential I and Q baseband signals. A multi-tone mode also makes the platforms useful in audio, non-linear distortion tests, and satellite communication test and measurement.

SSG5000X Series units support all analog modulation types and allow users to set and combine different types of frequency or amplitude sweeps. It also includes back-side Signal Valid and Trigger In/Out BNC-connectors for integration with automated test systems, and incorporates a web server so that it can be controlled remotely over an Ethernet connection.

Standard SSG5000X systems come with a 5" touch display. 

SSG5000X and SSG5000X-V RF Signal Generators are priced from $8,809. For more information visit

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at

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