The performance increase of modern processors, the integration of graphics solutions into processors and the integration of countless interfaces into processor chipsets are driving the trend away from 19” systems and towards solutions with a smaller form factor. Today a high-performance multi-core processor can accomplish what it took a modular multi-processor system to do in years past. Fewer expansion boards are needed because chipsets feature direct integration of many interfaces. Even the I/O concepts have changed. Today, designs use fieldbuses to accomplish what previously took many sensors and actuators separately connected to the system through I/O boards. In addition, trends like IoT and Industry 4.0 are creating a stronger push towards the use of smaller computer systems with increased performance, such as IoT gateways, in a wide variety of applications. One technology in the field of small form factor solutions is computer-on module (COM). Embedding these COM modules into the proper infrastructure creates functional computer systems for a wide variety of tasks and application areas.
This ebook provides answers to the following key questions:
- What are the advantages and disadvantages of mainboard versus COM modules with customized or modular carriers and compared to completely integrated COM systems?
- Which solution is ideal in terms of quantity, complexity, project duration and long-term availability of implemented components?