COMPUTEX Taipei: Lanner unveils strategy for all angles of the Industrial Internet

By Brandon Lewis

Editor-in-Chief

Embedded Computing Design

June 02, 2015

Walter Yeh's promise of a show focusing on the Internet of Things (IoT) was upheld in my very first meeting, as Brian Chen of Lanner Electronics walke...

Walter Yeh’s promise of a show focusing on the Internet of Things (IoT) was upheld in my very first meeting, as Brian Chen of Lanner Electronics walked me through the company’s four-pronged approach to intelligent systems. Chen says that over the past year, Lanner has devoted much of its attention to product development in the Intelligent Transportation, Building Automation, Industrial Cybersecurity, and Networking and Cloud sectors, yielding a portfolio can cover most IoT deployments from edge to datacenter.

Of particular interest were Lanner’s industrial networking products, which include the LEC-6000 series of industrial cybersec box PCs designed for automation and smart grid applications (Figure 1), as well as IPC building management solutions built around the Intel Gateway Solutions for the IoT that help operators increase energy efficiency and reduce costs. Being a member of the Intel’s IoT Solutions Alliance ensures that Lanner’s offerings are protected by Intel’s long-term embedded roadmap, and also enables the company to concentrate on architecting rugged, extended temperature systems for harsh environments.

 

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On the networking side, it will be interesting to see if Intel’s recent acquisition of Altera factors into the telecom and datacenter offerings of organizations like Lanner as well. To find out more about the merger, read this recent blog by Embedded Computing Design’s Rich Nass.

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Brandon Lewis, Technology Editor
Figure 1: Lanner’s LEC-6000 series of industrial cybersecurity box PCs can be installed throughout industrial networks to mitigate the risks of connecting safety-critical systems.

Brandon is responsible for guiding content strategy, editorial direction, and community engagement across the Embedded Computing Design ecosystem. A 10-year veteran of the electronics media industry, he enjoys covering topics ranging from development kits to cybersecurity and tech business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached at [email protected].

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