For the new standard modules TQMxE40M, TQMxE40S and TQMxE40C1/C2, TQ relies on the Intel® Atom® x6000E processor family of the 6th generation, which will be available with 12 different CPU derivatives for different performance classes and operating conditions. The processors, available as dual- and quad-core versions, impress compared to previous generations by an enormous increase in computing and graphics performance. A particularly economical headless variant without graphics will also be available. The processors are specified with a thermal power dissipation between 4.5 W and 12 W and, depending on the variant, with an extended temperature range (-40°C to +85°C ambient). For the first time in this processor class, up to 64 GB RAM are supported. Many other features are specially designed for IoT and real-time applications.
The memory interface of the COM Express® Mini module TQMxE40M is equipped with the fast LPDDR4/4x technology. The memory capacity can be selected in the range from 4 to 16 GByte. Up to four 3rd generation PCI Express lanes (8 GT/s) are available for the connection of up to 4 peripheral devices and can be flexibly configured in the BIOS. For the first time in the Atom® range, the new USB 3.2 Generation 2 standard is supported, which allows transfer rates of up to 10 Gbit/s. Two ports are available for this purpose. In addition, the module can be equipped with up to 256 GB eMMC flash. The COM Express® Mini module TQMx40M with its compact dimensions of 84 mm x 55 mm and Type 10 pinout is fully PICMG COM0 R3.0 compliant. The TQ mainboard MB-COME10-2 can be used for evaluation. Together with an 11 mm heatspreader and a heatsink, this results in an ideal evaluation platform.
The SMARC 2.1 module TQMxE40S offers additional possibilities for I/O connection due to the edge connector with 314 pins. Thus, 3 independent, high-resolution displays (up to 4K / 60 Hz) and 2 Gigabit Ethernet network interfaces are available. An ultra fast peripheral connection with 3rd generation PCI Express is also supported here (8 GT/s). Two CAN interfaces complete the functionalities. With its dimensions of 82 mm x 50 mm, the TQMxE40S module complies with the new SMARC 2.1 specification (short size) and is supported by the corresponding MB-SMARC-3 motherboard.
The two COM Express® Compact modules TQMxE40C1 (soldered memory, max. 16 GB) and TQMxE40C2 (pluggable SO-DIMM memory, max. 64 GB) differ in the memory technology used. Both support up to 8 PCIe lanes and 6 devices as well as 3 independent 4K displays, 2x SATA and 1x Gigabit Ethernet.
The modules are expected to be available in series in Q1/Q2 2021.