eSilicon to present at State of AI and ML - Spring 2019

April 2, 2019 eSilicon

April 02, 2019 14:50 ET | Source: eSilicon Corporation

SAN JOSE, Calif., April 02, 2019 (GLOBE NEWSWIRE) --

What:

eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, is giving a presentation on ASIC and deep learning at the State of AI and ML-Spring 2019 conference, to be held in Santa Clara, Calif.

Who:

Dr. Carlos Macian, Sr. Director AI Strategy and Products at eSilicon

An ASIC Approach to Unlock Deep Learning Innovation

AI/deep learning algorithms demand superior performance. While FPGAs, GPUs and other forms of dedicated processor help, a custom chip always provides the ultimate in performance with the lowest power and area. The challenge is mapping advanced and rapidly evolving algorithms to an ASIC in a predictable and cost-effective manner. eSilicon will present a unique approach to address this challenge.

When:

Thursday, April 4

3:30 PM Talk 3

eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC™ platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets. www.esilicon.com

Collaborate. Differentiate. Win.™

Previous Article
APEC Highlights: Part Two
APEC Highlights: Part Two

A strong turnout signals a shift in perception of power electronics from necessary evil to value-added syst...

Next Article
AMD President and CEO Dr. Lisa Su to Deliver COMPUTEX 2019 CEO Keynote on New High-Performance Computing Technologies

The 2019 COMPUTEX International Press Conference & CEO Keynote is called “The Next Generation of High-Perfo...