eSilicon to Participate in Panel Discussion on Chiplet Design Experience at a Workshop presented by the Open Compute Project (OCP)

July 1, 2019 eSilicon
Chiplet design experience panel
A portion of the ODSA workshop will focus on chiplets in three areas: (1) building a proof-of-concept, multi-chiplet part that integrates die from multiple vendors; (2) defining an open interface between chiplets; and (3) developing new workflow and business models for product development with chiplets. The agenda will also highlight areas in which the ODSA projects are looking for assistance.
Carlos Macian, senior director, AI Strategy and Products, eSilicon
Intel, AMD, Cisco and Xilinx will also be represented on this panel
When & Where
Monday, June 10, 2019
9:00 AM - 5:00 PM PDT
eSilicon panel 12:45 PM - 2:00 PM PDT
OCP ODSA Project Workshop
Intel Corporation HQ
3601 Juliette Lane
SC-9 Auditorium
Santa Clara, CA 95054-1513
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