Accelerating Time to Market with Industry Specific Solutions at the Advantech IoT Co Creation Summit

Winbond’s HyperRAM product offers low pin count, low power consumption, and high data bandwidth in miniature KGD form factor.

2.9 Micron Sensor for High Volume Surveillance Cameras Combines Low Power Consumption With High Performance, Selective Conversion Gain, Staggered HDR, and Near-Infrared and Low Light Capabilities

How to monitor social distancing, measure occupancy, and more using one edge-based AI platform: ADLINK Technology’s Vizi-AI

Build your dream ODM products with Shenzhen Wesion Technology Co., Ltd., an original design and manufacturing (ODM) company based out of Shenzhen China.

To understand how these ICs and technologies can function within your latest design, visit the Maxim Integrated virtual booth at CES 2021, starting on January 11, 2021.

OmniVision announced the OAX8000 AI-enabled, automotive-specific integrated circuit (ASIC). The new ASIC is optimized for entry-level, stand-alone driver monitoring system (DMS).

When considering hardware for high-performance neural networks, automotive engineers determine compute needs by simply adding NN requirements, which defines total system performance. Or does it?

One part of the puzzle is to equip the food or pharmaceutical processing facility with the ability to provide smart hygiene control using special panel computers or box computers.

CoreAVI announced the release of a new Safe AI and Computer Vision Solution that includes the VkCoreVX™ SC, a safety critical implementation of Khronos’ OpenVX™1.3 API.

So, how do COM-HPC connectors enable 2,088 Gpbs/in2? To answer that question, we have to understand the basic design features of COM-HPC connectors and how they contribute to that metric.

High-speed interfaces and provisions that allow modules to host PCIe targets mean that COM-HPC can support compute architectures ranging from Arm to GPUs to FPGAs and more.

EdgeQ Announced its launch from stealth with $51 million in total funding, including $38.5 million in a Series A round.

Results Highlight “Zero Effort” Architecture Benefits for Computing Neural Networks.

AIoT is the melding of AI and IoT. Until not too long ago, these were two independent technologies, for various reasons.

If you sit down and make a list of promising technologies, the two names that would most likely top it are Artificial Intelligence and the Internet of Things.

Micron Technology, Inc. (Nasdaq: MU), today announced that it has begun volume shipments of the world’s first 176-layer 3D NAND flash memory.