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About the Author
Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at email@example.com.Follow on Twitter Follow on Linkedin Visit Website More Content by Brandon Lewis
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This week, thanks to our sponsor Digi-key, we’re giving away 15 CY8CKIT-059 PSoC 5LP PROTOTYPING KITS from Cypress Semiconductor for free.
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In this series of five webcasts, we’ll run through the five key security-related problems that will impact your design, and more importantly, how to solve them.
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The dual-band, multi-protocol CC1352R SimpleLink wireless MCU that supports both 2.4 GHz technologies like Bluetooth, Bluetooth 5 Low Energy, Zigbee, and Thread, as well as Sub-GHz connectivity.
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In this edition of Dev Kit Weekly, Perry breaks down the AVR-BLE Development Board from Microchip.
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In this week’s Dev Kit Weekly, Perry Cohen reviews the NXP EdgeReady MCU-based Solution for Alexa Voice Service.
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In this edition of Dev Kit Weekly, Perry Cohen reviews the RX65N Cloud Kit from Renesas.
In this edition of Dev Kit Weekly, Embedded Computing Design associate editor, Perry Cohen, reviews the ST EVALKIT-ROBOT-1.
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