Embedded Insiders Podcast – Powerful Developments from APEC

March 16, 2018 Brandon Lewis

Rich Nass, one half of the Embedded Insiders, returned from the Applied Power Electronics Conference (APEC) last week. There, he was surprised to learn that semiconductor companies are no longer evaluating digital power or Silicon Carbide (SiC) and Gallium Nitride (GaN) power MOSFETs. They are actually already on their second and third generation of products.

Tune in for more.



About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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