Dev Kit Weekly: ON Semiconductor RSL10 Sensor Development Kit

June 20, 2019 Brandon Lewis

This week's kit is the RSL10 Sensor Development Kit from ON Semiconductor, which boasts the industry's lowest-power Bluetooth Low Energy (BLE)/Bluetooth 5 System on Chip (SoC). Don't believe me? Check out the device's score on the Embedded Microprocessor Benchmark Consortium (EEMBC) ULPMark test: https://www.eembc.org/ulpmark/scores.php.
 
The RSL10 device on the kit is actually a system-in-package that includes an Arm Cortex-M3-based radio SoC, an antenna, and other necessary passive components. The kit comes pre-certified to FCC, CE, IC, KC, and MIC wireless regulations, and supports a host of sensors to help you get prototyping in no time.
 
These include:
- Ambient light sensor
- 3-axis accelerometer and 3-axis gyroscope
- 3-axis digital geomagnetic sensor
- Integrated gas, pressure, humidity, and temperature sensor
- A low noise digital microphone
 
This version of the kit doesn't have a debug interface, but developers can get tinkering via the RSL10 Sense and Control mobile application, which is available via the Android and iOS ecosystems. The app can be used to read values from a 64 kB NFC EEPROM, and also helps users communicate with AWS, Microsoft, and other popular IoT clouds. So, in essence what you have here is an IoT sensor platform that is truly turnkey.
 
The kit will set you back $50 if you get it through a distribution channel. Or, it will set you back $0 if you sign up for and enter the raffle below:
 
 
If you're interested in learning more, visit the RSL10 Sensor Development Kit webpage at https://www.onsemi.com/PowerSolutions/evalBoard.do?id=RSL10-SENSE-GEVK. Or, ask @techielew.
 
See you next week...

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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