TechNexion will participate in embedded world 2018, underscoring its commitment to helping companies of all sizes as they take their technology innovations from idea to design to production. TechNexion will showcase next generation System on Modules, embedded mainboards, fanless computing, panel computing and Internet of Things devices along with other solutions at the annual embedded world exhibition and conference to be held February 27 to March 1, in Nürnberg, Germany. This year, TechNexion booth will be located in Hall 1, Stand 1-311.

For more information, visit www.technexion.com.