Dialog Semiconductor Launches TINY Bluetooth Low Energy SoC and Module

November 12, 2019 Tiera Oliver

Dialog Semiconductor plc announced both the new DA1453 and the DA14531 module to simplify Bluetooth product development.

The chip, also known as SmartBond TINY, is currently in production. It is designed to lower the costs of adding Bluetooth Low Energy (BLE) functionality to an application to as little as $0.50 in high volumes. 

SmartBond TINY is based on a powerful 32-bit ARM Cortex M0+ with integrated memories and a complete set of analog and digital peripherals, delivering a score of 18300 on the latest IoTMark-BLE, the EEMBC benchmark for IoT connectivity. Its architecture and resources allow it to be used as a standalone wireless microcontroller or as an RF data pipe extension for designs with existing microcontrollers.

The SmartBond TINY module makes it easy for customers to leverage the new SoC as a part of their product development. It is available in packages as small as 2.0 x 1.7 mm, and can be used in applications that require provisioning such as cameras, printers, and wireless routers, or in remote controls as a replacement for infrared (IR).

For more information on the latest device, visit:  www.dialog-semiconductor.com/press-releases/dialog-semiconductor-launches-tiny-bluetoothr-low-energy-soc-and-module-connect-next.

About the Author

Tiera Oliver, edtorial intern for Embedded Computing Design, is responsible for web content edits as well as newsletter updates. She also assists in news content as far as constructing and editing stories. Before interning for ECD, Tiera had recently graduated from Northern Arizona University where she received her B.A. in journalism and political science and worked as a news reporter for the university's student led newspaper, The Lumberjack.

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