Embedded Insiders: Defining Digital Twins

July 9, 2020 Brandon Lewis

In this edition of the embedded insiders, Brandon and Rich discuss how digital twins that reflect physical IoT systems can not only record the status of real-world devices, but simulate how the device could react under certain conditions in the future. And, how these twins can also potentially be used to help inform future designs.

Later, the insiders are joined by Brady Benware, VP and general manager of the Tessent portfolio at Mentor, a Siemens business. The company recently acquired UltraSoC, who focuses on on-chip analytics, among other things, perhaps allowing Siemens to address the concept of digital twins all the way down to the chip level.

After, Jean Labrosse is back with “things that annoy a veteran software engineer” where he explains why the inconsistent use of acronyms and abbreviations bothers him.

Tune in.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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