Complete SiP from Octavo Really is a Complete System

September 28, 2018 Rich Nass

Build it faster. Use less space. Reduce your BOM. It seems like every new component we write about spouts those same characteristics, or some form of them. So this time, I’ll let you make the decision for yourself as I discuss Octavo’s latest offering, the OSD335x C-SiP.

Octavo Systems has made a name for itself by putting nearly complete systems into tiny packages (aka SiPs). This latest offering comes really close to doing that by including a fair amount of memory inside the 27- by 27-mm, 400-ball BGA package.

Based on a 1-GHz Arm Cortex-A8 processor (a TI Sitara AM335x), the OSD335x C-SiP integrates up to 1 Gbyte of DDR3 RAM, 4 kbytes of EEPROM, two power supplies, up to 16 Gbytes of flash memory, a MEMS oscillator, and more than 100 passive components. In addition to the relatively large memory blocks, you typically don’t find an oscillator and dual power supplies in a part like this.

According to the Octavo technical folks, the only other hardware that’s needed to complete a Linux-based design is external power and some resistors.

It’s great that the C-SiP adds all these components. What it also does behind the scenes is remove most of the tasks that revolve around laying out a board, including how and where to put the bigger components to deal with heat and EMI issues.

While the list of potential applications is a long one, Octavo claims that the small size and high performance suit the device for things like building automation, industrial control, and consumer products, as well as any IoT-related system.

The OSD335x C-SiP will be available by the end of the year. The first variation will be built on the AM3358 processor, with 512 Mbytes of DDR3 memory, and 4 Gbytes of flash. It’ll be available in industrial and commercial temperature ranges.

About the Author

Rich Nass

Richard Nass is the Executive Vice-President of OpenSystems Media. His key responsibilities include setting the direction for all aspects of OpenSystems Media’s Embedded and IoT product portfolios, including web sites, e-newsletters, print and digital magazines, and various other digital and print activities. He was instrumental in developing the company's on-line educational portal, Embedded University. Previously, Nass was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events in the U.S., Europe, and Asia. Nass has been in the engineering OEM industry for more than 25 years. In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites. Nass holds a BSEE degree from the New Jersey Institute of Technology.

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