Cervoz 3D MLC and TLC NAND Flash Storage Solution

December 3, 2019 Cervoz Co., Ltd.

Shrinking cell size, pursuing higher performance and reducing power consumption have always been the three ultimate goals to reach for NAND Flash memory manufacturers. Storage capacity can be increased by smaller-advanced cell size, high-speed calculation can be achieved by greater performance and heat dissipation of storage can be improved by efficient power management.  


 
3D NAND is developed & designed to overcome the limitations from current planar technology, accomplishing above advantages without sacrificing product reliability.

Cervoz 3D NAND Solutions

3D MLC Solution
Industrial 2.5" SATA SSD (M335 / M336 / M339 / R335 / R336)
Industrial Embedded mSATA (M335 / M336 / R335 / R336)
Industrial Embedded M.2 2242 (M335)
Industrial Embedded M.2 2280 (M335)​

3D TLC Solution
Industrial 2.5" SATA SSD (T380 / T385)
Industrial Embedded mSATA (T380 / T385)
Industrial Embedded Half Slim (T380 )
Industrial Embedded M.2 2242 (T380)
Industrial Embedded M.2 2280 (T380)
Industrial Embedded M.2 2280 NVMe (T405)

Previous Article
Panasonic's HMx700 Series Operator Panels Offer Multi-Touch Functionality
Panasonic's HMx700 Series Operator Panels Offer Multi-Touch Functionality

The panel accepts several touch gestures, such as wiping, enlarging, reducing, scrolling, and others.

Next Article
Denchi Group to Expand its Engineering Capability with Additional Design Team in Heart of Cambridge Technology Cluster
Denchi Group to Expand its Engineering Capability with Additional Design Team in Heart of Cambridge Technology Cluster

Company announces new job openings across its entire operation.