u-blox M9 GNSS Delivers Low-Latency Meter-Level Positioning, Anti-Spoofing Mechanisms

October 17, 2019 Brandon Lewis

u-blox has released the M9 Global Positioning Technology Platform, UBX-M9140 GNSS chip, and NEO-M9N GNSS module. M9 devices are capable of receiving concurrent signals from GPS, Glonass, Beidou, and Galileo GNSS constellations, which helps deliver horizontal positional accuracies as close as 1.5 m even in dense urban canyon environments. A 25 Hz position update rate also supports low-latency positional information.

In addition, M9 devices integrate surface acoustic wave (SAW) filters, low noise amplifier (LNA) filters, and advanced detection algorithms that protect against RF interference (from co-located celluar modems, for example), jamming, and spoofing.

The technologies are compliant with ISO/TS 16949, ISO 16750, and AEC-Q100 standards. The UBX-M9140 GNSS chip is available in a 5 mm x 5 mm QFN package rated for industrial and automotive use. The NEO-M9N is a 12.2 mm x 16 mm headless chip carrier package that is rated for industrial use and compatible with other u-blox NEO products.

The compatibility of the NEO platform means that users will be able to migrate to technologies like dead reckoning in the future.

u-blox has also announced the XPLR-M9 Explorer Kit development board, which is accompanied by the company’s u-start software.

For more information on the UBX-M9140 chip, visit www.u-blox.com/en/product/ubx-m9140-chip.

For more on the NEO-M9N module, visit www.u-blox.com/en/product/neo-m9n-module#tab-documentation-resources.

For more on the XPLR-M9 development kit, visit www.u-blox.com/en/product/xplr-m9.

Or, learn more from u-blox at Mobile World Congress Los Angeles in South Hall booth S.2702.

 

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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