Embedded Computing Design's Rich Nass talks to Mory Lin of Super Micro at Embedded World booth #3A-510.
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Embedded Computing Design's Brandon Lewis speaks with Gareth Noyes of Wind River at Embedded World booth #4...
Deciding what hardware to use for your embedded GUI application? From understanding performance and storage requirements to estimating memory needs, you’ll be faced with quite a few important...
SensiML announced its SensiML Analytics Toolkit is now integrated with Google’s TensorFlow Lite for Microcontrollers.
Initial orders for devices and testing cartridges which will be delivered to potential launch customers in September and October 2020
Silex Insight, and Faraday Technology Corporation announce their collaboration for delivering secure IoT solutions for a wide range of ASIC applications.
Texas Instruments released a custom version of the PSpice® simulator from Cadence Design Systems, enabling engineers the ability to simulate complex analog circuits.
This week we’ll be giving away 9 of the Infineon XENSIV Sensors Getting Started Box IoT Development Kits for free, thanks to our sponsor Digi Key.
MachXO3LF and MachXO3D FPGAs Support Extended Temperature Range for Automotive and other Ruggedized Applications
Collaboration will fast track the development and scale-up of Evonetix’s desktop DNA writer towards commercialisation and first product
A recent report from Ber Insight, an IoT market research firm, show that IoT managed service providers have more than 50 million IoT subscribers worldwide.
Rohde & Schwarz announced the release of the R&S FSW-B8001, an option that extends the internal analysis bandwidth of the R&S FSW high-end signal and spectrum analyzer to 8.3 GHz.
Open Source solutions are a great way to build, deploy, and support data flows and other processes, but to make the most of them, you need a smart approach.
In this week’s Embedded Executives podcast, I spoke to NXP’s Ron Martino, Senior Vice President and General Manager of Business Line Edge Processing.
Neurala, a vision AI software company, announced the launch of the Neurala VIA Authorized Partner program. The program aims to help manufacturers leverage vision AI to improve quality inspection.
Xilinx announced the release of the T1 Telco Accelerator card for O-RAN distributed units (O-DUs) and virtual baseband units (vBBUs) in 5G networks.
Open RAN looks like our best bet for a competitive 5G infrastructure market. But existing implementations are too expensive. We need more chips and suppliers to build DU and RU units for 5G at scale.
GigaDevice is a new entrant to my radar. The company’s history is in memory products, but it is now a formidable player in the MCU space, both on the Arm and RISC-V sides (which is fairly unique).
A recent study by McKinsey estimates that the IoT in the retail industry will have an economical impact ranging from approximately $410 billion to $1.2 trillion per year by 2025.
Microchip Technology announced a partnership with Cartesiam, Edge Impulse, and Motion Gestures to simplify ML implementation at the edge.
There’s no denying the impact Bluetooth has had on the lives of consumers, and to the credit of the embedded community, innovation continues to occur in that space, at a healthy pace.
MASS will provide automotive OEMs and their suppliers with end-to-end connectivity solutions for the growing number of cameras, sensors, and displays that enable automotive applications.