STMicroelectronics, Fieldscale Bring Touch Controls to STM32-Based Devices

January 27, 2020 Rich Nass

STMicroelectronics and Fieldscale, a provider of simulation software, have announced a partnership to simplify the development process for adding touch interfaces to embedded systems. Their work adds the technology to smart devices containing ST’s STM32 microcontrollers (MCUs). Specifically, support is included on ST’s Arm Cortex-based 32-bit MCUs for Fieldscale’s Sense development platform.

Fieldscale Sense is an end-to-end solution for the design, schematic capture, and system-level simulation of capacitive touch sensors. The latest version lets STM32 users quickly design the touch sensor and PCB layout for virtual system simulation purposes.

Touch-sensitive controls are becoming more popular, especially for smart consumer devices as well as industrial platforms. However, developing such systems can be a challenge for a designer. By laying the groundwork for the designer, the process is greatly simplified, and can be done with cloud-based tools that are already familiar.

Before committing to building physical prototypes, with developers can design or import capacitive touch sensor layout as a standard DXF or Gerber file(s). They can also create 3D models of the sensor by clicking their way through material and connections assignment. Fieldscale Sense automatically applies the appropriate boundary conditions.

Fieldscale Sense is available now as an online service and comes with a flexible pricing model based on specific needs.

About the Author

Rich Nass

Richard Nass is the Executive Vice-President of OpenSystems Media. His key responsibilities include setting the direction for all aspects of OpenSystems Media’s Embedded and IoT product portfolios, including web sites, e-newsletters, print and digital magazines, and various other digital and print activities. He was instrumental in developing the company's on-line educational portal, Embedded University. Previously, Nass was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events in the U.S., Europe, and Asia. Nass has been in the engineering OEM industry for more than 25 years. In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites. Nass holds a BSEE degree from the New Jersey Institute of Technology.

Follow on Twitter Follow on Linkedin Visit Website More Content by Rich Nass
Previous Article
Miele to use Security Chips from G+D Mobile Security
Miele to use Security Chips from G+D Mobile Security

Miele announced it will be implementing new security chips from Giesecke+Devrient to protect intelligent de...

Next Article
The Worst of CES
The Worst of CES

I'm taking a different approach in this article and talking about four things that happen every year that d...