Smart Equipment Technology (SET) Introduces New Automatic Flip-Chip Bonder for Device Production

December 2, 2019 Perry Cohen

Smart Equipment Technology, a supplier in die-to-die and die-to-wafer bonders, announced the release of NEO HB, an automatic flip-chip bonder designed for ± 1 µm 3σ post-bonding accuracy, in stand-alone or full automatic mode (EFEM).

The first of a new line of SET flip-chip bonders dedicated entirely to production, the tool combines precision, flexibility, short cycle time, and creative design. It was developed in collaboration with CEA-Leti as part of IRT Nanoelec's 3D integration program.

Séverine Chéramy, director of IRT Nanoelec's 3D integration program, said the objective when SET joined the consortium was to provide IC designers with 3D die-to-wafer stacking at an aggressive pitch - less than 10µm - at high speed, at room temperature, and without pressure or underfill.

Hughes Metras, the recently appointed director of Nanoelec, said the institute's collaboration with SET demonstrates both the success of its mission of technology development and transfer and the strength of its 3D integration program.

For more information, visit http://www.irtnanoelec.fr/en/

About the Author

Perry Cohen

Perry Cohen, associate editor for Embedded Computing Design, is responsible for web content editing and creation in addition to podcast production. He also assists with the publication’s social media efforts which include strategic posting, follower engagement, and social media analysis. Before joining the ECD editorial team, Perry has been published on both local and national news platforms including KTAR.com (Phoenix), ArizonaSports.com (Phoenix), AZFamily.com, Cronkite News, and MLB/MiLB among others. Perry received a BA in Journalism from the Walter Cronkite School of Journalism and Mass Communications at Arizona State university. He can be reached by email at perry.cohen@opensysmedia.com Follow Perry’s work and ECD content on his twitter account @pcohen21

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