This white paper focuses on the Open Memory Interface (OMI) and how it addresses the needs of near memory. Innovations in memory infrastructure are poised to significantly improve the performance and cost effectiveness of mainstream data center applications. Business applications are under significant pressure to collect, analyze, store and deliver time-sensitive value to end customers while simultaneously driving down costs. These applications are drawing upon large quantities of global data sources — sensor data, historical data, location data, and customer-specific data — all of which must be scrutinized in real time. Memory infrastructure innovation is occurring along two vectors: near memory innovations and far memory innovations. Near memory innovation improves business application performance by driving up the number of SoC and CPU memory channels, and improving the bandwidth of those individual memory channels while enabling innovative and lower cost memory technologies to be connected seamlessly to the SoC.
Antenova, a UK-based manufacturer of antennas and RF antenna modules for IoT and M2M applications, released...
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MAXREFDES104# is a wrist form factor reference design ready to collect blood oxygen, ECG, heart rate, body temperature and activity data.
Infineon Technologies released the Connected home security evaluation kit with OPTIGA™ Trust M for Raspberry Pi.
Per the company, this latest definition of the LoRaWAN standard includes all required implementation elements to facilitate LoRaWAN deployments globally.
The demonstration took place as part of the IMT-2020/CAICV/China SAE 2020 C-V2X "New Four Layers" event.
Real-time kinematic support enables centimeter-level accuracy.
First-of-its-kind concept aims to accelerate the transition from proofs of concept to volume production, and advance the adoption of piezoelectric (Piezo) MEMS in new applications.
Home automation, and the Internet of Things, has been the technology of the near future for what seems like well over a decade now.
The threshold voltage is the minimum voltage required for the flow of electrons through the channel. It is denoted by VTH of a MOSFET.
In practice, an unclonable identity solution is generated from within the PUF SRAM chip. Note this can be easily provisioned and implemented at low cost within the IoT device.
I spoke to Steve Hanna, a multi-hatted engineer. Steve is a Senior Principal at Infineon Technologies, Co-Chair of the Embedded Systems Work Group in the Trusted Computing Group.
The ASDM-L-CFS pairs the processor with up to 32 GB DDR4 SODIMM memory for ideal computing performance.
TapNLink wins with secure, intuitive NFC 3-Stroke connection for mobiles that eases configuration of HVAC appliances and industrial equipment.
Beep will Operate the Nation’s First Self-Driving Shuttle Pilot at a National Park in Spring of 2021
A new report from Semico Research, New Directions in the EDA Market: Designing with AI Tools (SC109-20) projects the initial potential cost savings from using such tools for SoC designs.
Internet of things (IoT) devices have become the largest driver of semiconductor revenue, with wireless communication, automotive, and artificial intelligence products following in short order.
The kit contains 8 IoT projects that can offer different experiences for each user based on their individual level of expertise, from maker to professional.
InferX X1P1 PCIe board at $399-$499 brings datacenter class throughput to lower price point edge servers; InferX X1P4 in 2021 will increase throughput 4x
ACEINNA and Point One are delivering a reliable, turn-key, and affordable GNSS correction solution.
B-Series is designed to deliver ideal performance per mm2 for GPU IP while offering new configurations for lower power and up to 35% lower bandwidth for a given performance target.