OmniVision Announces New 12” Wafer-Based Sensor for Mobile Cameras

February 20, 2020 Tiera Oliver

OmniVision Technologies announced the latest member of its 2 megapixel (MP) image sensor family, the OV02B. OmniVision is using 12’’ wafers to produce this sensor, instead of the 8” wafers typically used for 2MP sensors. 

The OmniPixel3-HS pixel technology provides the OV02B with a 1.75 micron pixel pitch in a 1/5” optical format. While maintaining the same cost as its predecessor, the OV02A, the OV02B has an added SCCB ID (SID) pin, which provides two available hardware I2C addresses to meet the requirements of multicamera applications. It also adds a hardware strobe pin to sync LED flash photography, along with 32 bytes of on-chip OTP memory for storing automatic white balance (AWB), and manufacturer production information. Using a Bayer pattern, it supports both color and monochrome, while also providing a chief ray angle (CRA) of up to 30.69˚.

The OV02B is designed for the main and front-facing bokeh cameras in entry level and mainstream smartphones where 2MP has become the industry standard. It also provides a cost-effective solution for the main tablet and notebook cameras. Output formats include 1600x1200 at 30 frames per second (fps) and 800x600 at 60fps.

Samples of the OV02B image sensor are available now. For more information, contact your OmniVision sales representative: or visit:

About the Author

Tiera Oliver, edtorial intern for Embedded Computing Design, is responsible for web content edits as well as newsletter updates. She also assists in news content as far as constructing and editing stories. Before interning for ECD, Tiera had recently graduated from Northern Arizona University where she received her B.A. in journalism and political science and worked as a news reporter for the university's student led newspaper, The Lumberjack.

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