KIOXIA America Introduces 512GB Automotive UFS

November 14, 2019 Perry Cohen


KIOXIA America, formerly Toshiba Memory America, announced that it has begun testing the 512 gigabyte (GB) Automotive Universal Flash Storage3 (UFS) JEDEC Version 2.1 embedded memory solution.

The Automotive UFS supports a temperature range of -40°C to +105°C, meets AEC-Q100 Grade24 requirements and offers the extended reliability required by various automotive applications.

The 512GB device joins the company’s existing lineup of Automotive UFS, which includes capacities of 16GB, 32GB, 64GB, 128GB, and 256GB.

UFS was developed for large-capacity memory, which integrates the company’s BiCS FLASH 3D flash memory and a controller in a single package. It features several functions that comply with requirements of automotive applications including Refresh, Thermal Control, and Extended Diagnosis. 

For more information, please visit


About the Author

Perry Cohen

Perry Cohen, associate editor for Embedded Computing Design, is responsible for web content editing and creation in addition to podcast production. He also assists with the publication’s social media efforts which include strategic posting, follower engagement, and social media analysis. Before joining the ECD editorial team, Perry has been published on both local and national news platforms including (Phoenix), (Phoenix),, Cronkite News, and MLB/MiLB among others. Perry received a BA in Journalism from the Walter Cronkite School of Journalism and Mass Communications at Arizona State university. He can be reached by email at <a href=""></a>. Follow Perry’s work and ECD content on his twitter account @pcohen21.

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