The need to decrease the bill of material (BOM) costs in embedded products is being driven by the need for high volume, low-cost sensor systems. As IoT devices become more sophisticated, they require developers to utilize digital signal processing (DSP) to handle more features within the product, such as device provisioning.
- Embedded Security Webinar Series
- Machine Learning
- Power Electronics
- Dev Tools & OS
- Dev Kit Selector
- White Papers
- Upcoming Activities & Events
- Embedded Executive
The solution also synchronizes directly with Octopart supply chain data to offer insight into product avail...
We also recommend:
Industry 4.0, aims to bring massive changes in the make-up of production systems, but most importantly changes in the way they create value and how they interact with the world that surrounds them.
Products designed for space are exposed to the some of the harshest environments. They must operate reliably under intense vibration, mechanical shock, wide temperature swings, and more.
SECO CHPC-C77-CSA comes in the COM-HPC® / Client standard form factor in Size A. Memory-wise, it supports up to 64 GB of DDR4-3200 on two DDR4 SO-DIMM Slots with IBECC.
For the first time in many years, high-end embedded processors are available on two Computer-on-Module form factor options, COM-HPC® Client and COM Express® Type 6.
This week on Dev Kit Weekly, we’ll be giving away one OpenRTK330LI Evalution Kit from Aceinna for free.
N.A.T, a supplier of embedded boards and systems based on open standards, release new software defined radio (SDR) products for wireless network developers.
Have you ever checked how many entries are in the web for “design buffer for an ADC”? It can be hard to find what you are looking for among more than 4 million references.
Vishay announced the extension of its TNPW e3 series of automotive grade, high stability thin film flat chip resistors.
Featuring workstation-grade platform, system-oriented integration, flexible configurations and rugged reliability, ECX-2200/2100 expandable embedded system is ideal for Factory Automation
Otii Arc is a power analyzer, log sync and power supply all in one, making it the ultimate tool for any developer wanting to design highly energy-efficient IoT products.
Li Auto will be the first OEM to use the powerful NVIDIA Orin system-on-a-chip (“SoC”) in its full-size extended-range electric vehicles to be launched in 2022.
ON Semiconductor and SUBARU redefine ADAS capability with new machine vision algorithms and sensing technology.
Data acquisition (DAQ) systems find their use in many industries, for a wide range of applications, such as research, analysis, design verification, manufacturing, and testing.
GUI toolkit for Linux enhances 32-bit microprocessor capabilities for low- and mid-range- resolution graphical displays.
What is the future of IC design jobs? Will AI replace IC designers? These are questions that have been repeatedly asked at many technical conferences I have attended lately.
Learn how to bake cybersecurity into can’t-fail edge devices in this educational video series with Wind River. The seven-part series compresses the entire security lifecycle into less than 30 minutes.
Maxim Ventures has already seen some level of success, as Chris Neil, a Senior Vice President of Maxim Ventures, explains in this week’s Embedded Executives podcast.
The widespread adoption of advanced machinery has fueled unprecedented levels of speed and efficiency in factories around the world.
The German technology company TQ presents the TQMxE40 module family based on the processors of the latest Intel Atom® x6000E as well as Intel® Pentium® and Celeron® N and J series.
OnLogic announced a partnership with AMD, allowing consumers access to a new line of industrial servers that are powered by the two company’s processors, AMD Ryzen and AMD EPYC.