San Jose, CA and Guangzhou China April 2, 2019. – GOWIN Semiconductor Corporation, the world’s fastest growing programmable logic company, announces winning “Best FPGA/Processor of the Year” at the 2019 China IC Design Awards Ceremony in Shanghai, China on March 29, 2019. The event was sponsored for the 16th year by AspenCore, publisher of EE Times, where GOWIN won the outstanding innovative design concepts and market performance honors for their GW1NS2-QN32 FPGA-SoC product.

The China IC Design Award is the highest award in China's semiconductor industry. All awards are voted by IC design companies and engineers. This award reaffirms the success of GOWIN on the road of product innovation and differentiated features and design. “It’s an honor to win this award and be recognized by our peers as an innovator in the FPGA market,” said TP Wang, Vice President of Engineering, GOWIN Semiconductor. “Our success is not only attributed to new design techniques in FPGA’s allowing for our feature-rich, small size, and low power product, but also to our outstanding engineering team for thinking outside the box in development.”

The GW1NS2-QN32 chip is an FPGA-SoC product released by GOWIN in July 2018. The GW1NS2-QN32 FPGA-SoC chip is embedded with an ARM Cortex-M3 hardcore processor for easy to use, minimum setup functionality. It integrates USB2.0 PHY, user flash, FPGA fabric flash, SRAM, and ADC. It is supported by GOWIN’s toolchain that does both FPGA programming and processor IDE software development. The embedded FPGA logic fabric is convenient and flexible, allowing many peripheral control functions that provide excellent computational performance and anomalous system response interrupts.

GOWIN’s GW1NS2-QN32 FPFA-SoC product realize seamless connections between programmable logic devices and embedded processors. It is compatible with a variety of peripheral device standards, reducing user costs as it is widely deployed in industrial control, communication, Internet of Things, servo drives, smart home, security applications, consumer electronics, and AI edge computing.

About GOWIN Semiconductor Corp.

Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers to use programmable logic devices. Our commitment to innovative features, technology, and quality enables customers to reduce the total cost of ownership by using our FPGA’s on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.

For more information about GOWIN, please visit www.gowinsemi.com

Media Contact:

Scott Casper

GOWIN Semiconductor

[email protected]