Amaro (Italy), October 7th, 2020 – Eurotech, a long-time leading provider of embedded systems and a global leader in Internet of Things (IoT) enablement, expands embedded module product portfolio with the CPU-180-01, a high performance fanless module designed to provide efficient performance at the Edge.
The CPU-180-01 is a COM-HPC Client module that features the 11th Gen Intel® Core™ processors. Designed for fanless applications in harsh environments where long term reliability is a must, the CPU-180-01 delivers up to 4 processor cores, the integrated Intel® Iris® Xe graphics with up to 96 execution units and up to 32GB in-band ECC LPDDR4. It features an all-soldered down design to improve resilience and thermal coupling and comes with a -40 to +85°C operating temperature and a 15 to 28W TDP. The CPU-180-01 is very compact: at just 95x120mm (Size A) is the smallest module with a COM-HPC form factor.
Both the CPU and the integrated GPU deliver great performance improvements compared to the previous generation processors and offer AI and Deep Learning inference acceleration. Video encoding and decoding capabilities are also brought to the next level with support for 1080p streams and four independent displays.
The CPU-180-01 brings novel capabilities: it features Time Sensitive Networking (TSN) on a 2.5 Gb Ethernet port, which combined with Time Coordinated Computing (TCC) enables soft Real Time applications. TSN is an evolution of the Ethernet standard that provides time determinism to networked communications, while staying completely compatible with the existing Ethernet infrastructures. TCC bridges the synchronization of the internal clocks with the network to achieve microsecond accuracy.
The CPU-180-01 features the latest high-speed interfaces: PCIe Gen 4, with a bandwidth that is twice the previous generation and Thunderbolt™ 4 / USB 4 that enables PCIe, Video, USB and Power Delivery over a single, standard connector.
“The feature set offered by the 11th Gen Intel® Core™ processors is so rich and advanced that it really benefits from the new COM-HPC Client form factor” commented Giuseppe Surace, Eurotech’s Chief Product and Marketing Officer “The CPU-180-01 targets AI, soft real time and advanced graphics applications at the Edge, and offers a standardized, future-proof building block for fanless devices that must be reliable, efficient and with a long life-cycle”.
The COM-HPC Client standard offers unprecedented capabilities in a compact, rugged modular format. Defined by PICMG, the same non-profit consortium that created the hugely successful COM Express standard, COM-HPC targets Server-On-Module use cases. Supporting two pinouts (Server and Client) and multiple form factors, it is designed to provide a large number of PCIe Gen4/Gen5 lanes (65 or 49), very high-speed Ethernet (8x25 or 2x 25), USB4 and up to 4 video ports (Client only).
Supported operating systems include Everyware Linux (based on Yocto), Linux and Windows 10 IoT Enterprise; additionally, the CPU-180-01 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/OSGi middleware for IoT gateways.
The CPU-180-01 is offered in a range of configurations; additional personalization is available through Eurotech Professional Services.
CPU-180-01 availability: Q2’21. Contact us for further information.
Eurotech (ETH:IM) is a multinational company that designs, develops and supplies Edge Computers and Internet of Things (IoT) solutions – complete with services, software and hardware – to system integrators and enterprises. By adopting Eurotech solutions, customers have access to IoT building blocks and software platforms, to Edge Gateway to enable asset monitoring and to High Performance Edge Computers (HPEC) conceived also for Artificial Intelligence (AI) applications. To offer increasingly complete solutions, Eurotech has activated partnerships with leading companies in their field of action, thus creating a global ecosystem that allows it to create "best in class" solutions for the Industrial Internet of Things. Learn more