Embedded Executives: David Kleidermacher, VP of Engineering, Head of Android Security and Privacy, Google

April 8, 2020 Rich Nass
 

The Internet of Secure Things Alliance (IoXT) is pushing a common (and obvious) goal for our industry. They want to keep all of our connected devices secure. How do they do that, who belongs to the Alliance, and what does the future hold? These are the questions I asked of David Kleidermacher in this week’s Embedded Executives podcast. David sits on the Alliance’s Board, and is also the Vice President of Engineering and Head of Android Security and Privacy at Google.

About the Author

Rich Nass

Richard Nass is the Executive Vice-President of OpenSystems Media. His key responsibilities include setting the direction for all aspects of OpenSystems Media’s Embedded and IoT product portfolios, including web sites, e-newsletters, print and digital magazines, and various other digital and print activities. He was instrumental in developing the company's on-line educational portal, Embedded University. Previously, Nass was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events in the U.S., Europe, and Asia. Nass has been in the engineering OEM industry for more than 25 years. In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites. Nass holds a BSEE degree from the New Jersey Institute of Technology.

Follow on Twitter Follow on Linkedin Visit Website More Content by Rich Nass
Previous Article
Spirent Releases SimHIL, HIL Software Testing Solution
Spirent Releases SimHIL, HIL Software Testing Solution

Spirent Communications announced the release of SimHIL, an integrated hardware-in-the-loop (HIL) testing so...

Next White Paper
Advancements in High Reliability Interconnection Systems: Miniaturization of Connectors for the New High Speed Digital Electronics
Advancements in High Reliability Interconnection Systems: Miniaturization of Connectors for the New High Speed Digital Electronics