AVX released the λ-Bridge (Lambda-Bridge) Series of thermal conductors, made with aluminum nitride (AlN) or beryllium oxide (BeO) materials. The devices provide thermal management solutions in 0302, 0402, 0603, and 0805 sizes. Designed to direct heat to thermal ground planes, heat sinks, or other points of thermal interest, the series exhibits high thermal conductivity, low thermal resistance, and very low capacitance.
With RoHS-compliant SMT packages, the thermal conductors are used between active-device and adjacent ground planes, between a specific contact pad and case, or between contact pads, and as direct component contacts in GaN power amplifiers, high-power RF amplifiers, filters, synthesizers, industrial computers, switch-mode power supplies, and pin and laser diodes.
Standard configurations offer two standard thicknesses ranging from 20-40mils (T1) and 15-25mils (T2), in edge-wrap (fully-metalized edge) and no-wrap styles, and with either gold-over non-magnetic barrier terminations or gold-over-magnetic terminations. Custom configurations are also available.
AlN Lambda-Bridge thermal conductors exhibit thermal resistance values spanning 10°C/W to 25°C/W (T1) and 16°C/W to 32°C/W (T2); thermal conductivity values spanning 40mW/°C to 100mW/°C (T1) and 30mW/°C to 60mW/°C (T2); and capacitance values spanning 0.06-0.13pF (T1) and 0.05-0.08pF for edge-wrap versions. Non-wrapped versions have even lower capacitance values.
BeO Lambda-Bridge thermal conductors exhibit thermal resistance values spanning 7°C/W to 16°C/W (T1) and 11°C/W to 21°C/W (T2); thermal conductivity values spanning 61mW/°C to 153mW/°C (T1) and 46mW/°C to 92mW/°C (T2); and capacitance values spanning 0.05-0.10pF (T1) and 0.04-0.07pF for edge-wrap versions.
For more information, visit www.avx.com.
Embedded Computing Design
Embedded Computing Design
