Altium Concord Pro Cloud Platform Simplifies Component Library Management for PCB Design Teams

October 30, 2019 Brandon Lewis

Altium has released Concord Pro, a cloud-based ECAD component management platform that allows PCB designers to share and reuse schematics, footprints, 3D models, and other data across the PCB design process. The solution also synchronizes directly with Octopart supply chain data to offer insight into product availability, lead-time, cost, and alternatives.

The Concord Pro platform runs on the Altium 365 cloud infrastructure, and integrates with Solidworks, Invetor, and PTC Creo so that MCAD and ECAD teams can instantly share PCB design updates. Templated component data authoring ensures that information can be easily requested, accessed, and understood from a single location.

Additional features include component traceability that can be used to track where components have been used in the past. The platform also offers role-based access controls so that buyers and manufacturing partners can benefit from the simplified use and maintenance of component libraries.

In addition to a managed cloud offering, Concord Pro can be deployed on-premise and accessed through Altium Designer 19 or 20.

Visit www.altium.com/concord for more information or to access a free trial.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

Follow on Twitter Follow on Linkedin Visit Website More Content by Brandon Lewis
Previous Article
The Market for IP Cores

Inserting an IP core into your SoC can save valuable time and resources. Such designs are growing in popula...

Next White Paper
How to reduce the bill of material costs with digital signal processing
How to reduce the bill of material costs with digital signal processing

The need to decrease BOM in embedded products is being driven by the need for high volume, low-cost sensor ...