ACM Research introduced its Ultra SFP ap tool for advanced packaging solutions. The tool was designed to address yield issues arising from through-silicon via (TSV) processes and fan-out wafer-level packaging (FOWLP).
The Ultra SFP ap leverages ACM’s stress-free polishing (SFP) technology. Additionally, the company’s technology couples with chemical mechanical planarization (CMP) and wet-etch chambers into a single system.
ACM also announced it delivered the first Ultra SFP ap to a leading Chinese wafer-level packaging provider during the fourth quarter of 2019. The outsourced assembly and test customer, who was not named in the press release, currently has the tool on its research and development line. The first round of qualification data is expected mid-2020.
The Ultra SFP ap’s proprietary electrochemical reaction mechanism involves the simultaneous delivery of electrolytes and a power source to the wafer as it rotates on the chuck to electrically remove metal ions from the wafer surface.
For more information, visit http://www.acmrcsh.com/
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