VersaLogic Releases Dual Channel CAN Bus Expansion Module in Mini PCIe Format

January 8, 2020 Tiera Oliver

VersaLogic released the C1 module, an expansion of the companies’ industrial temperature, rugged Mini PCIe products. The Dual Channel CAN Bus expansion board provides high-speed CAN Bus ports to any embedded computer systems, including those in hostile environments.

The C1 supports CAN-FD and high speed signaling up to 5 Mbps. It is also backwards compatible with CAN 2.0 A and CAN 2.0 B with signaling up to 1 Mbps. The module supports an abundance of CAN functions including message acceptance filter and listen-only mode.

Additionally, the new industrial temperature product expansion supports the CANopen protocol, which standardizes communication between devices and applications from different manufacturers. It was developed for embedded systems used in automation, making it compatible for applications such as industrial machinery, defense & aerospace, medical equipment, and specialty vehicles.

2.5 kV of signal isolation is provided by C1 in efforts to protect the host computer and increase system resilience.

“Customers can now easily add high-speed CAN ports to any embedded systems with reliable, full performance operation even in industrial temperature applications (-40° to +85°C)” said VersaLogic president, Len Crane, in a press release. “This tiny Mini PCIe expansion board takes thermal management seriously. It will run at full speed across the full industrial temperature range.”

Fully tested thermal management assures reliable operation over the full industrial temperature range (-40° to +85°C), according to the company. Latching connectors and MIL-STD-202H shock and vibration testing ensures performance in demanding conditions.

The C1 is compatible with a variety of operating systems including Linux and Windows. It is supported by the VersaLogic Application Programming Interface (VersaAPI). Example C code is provided to speed initial software development time.

For more information, visit VersaLogic.com

 

 

About the Author

Tiera Oliver, edtorial intern for Embedded Computing Design, is responsible for web content edits as well as newsletter updates. She also assists in news content as far as constructing and editing stories. Before interning for ECD, Tiera had recently graduated from Northern Arizona University where she received her B.A. in journalism and political science and worked as a news reporter for the university's student led newspaper, The Lumberjack.

Follow on Twitter Follow on Linkedin Visit Website More Content by Tiera Oliver
Previous Article
Renesas Electronics' High-Efficiency Power Management IC  Adopted in Google Coral AI Products
Renesas Electronics' High-Efficiency Power Management IC Adopted in Google Coral AI Products

Renesas Electronics, a supplier of semiconductor solutions, announced its ISL91301B Power Management IC (PM...

Next Article
Qoitech Approved to Help Companies Launch Low Power, Cellular IoT Devices on AT&T Network
Qoitech Approved to Help Companies Launch Low Power, Cellular IoT Devices on AT&T Network

AT&T approved Qoitech as part of its partner program to provide IoT companies assistance in hardware and so...