STMicro Launches FCC-certified, ROM-based Teseo-LIV3R GNSS Module

June 17, 2019 Brandon Lewis

STMicro has released the Teseo-LIV3R, an FCC-certified ROM-based GNSS module. The Teseo-LIV3R enables simultaneous tracking of GPS, Glonass, Beidou, and QZSS constellations, and leverage satellite-based augmentation system (S-BAS) and Radio Technical Commission for Maritime Services (RTCM) Version 3.1 to deliver accuracies within 1.5 meters. The modules also respond to proprietary National Marine Electronics Association (NMEA) commands.

The 9.7mm x 10.1mm LCC18 Teseo-LIV3R devices support a tracking sensitivity of -163 dBm and a time-to-first-fix of below one second. The modules consume less than 15 µA of power in standby mode, while also supporting low-power modes such as adaptive continuous-fix, periodic-fix, and fix-on-demand modes.

In addition, the Teseo-LIV3R offers three trip counters, reached-distance alert capabilities, and geofencing provisions that enable up to eight configurable circles and crossing-circle alarms. Real-time assisted GNSS is available with free server access for uninterrupted positioning and navigation data.

Teseo modules are available for evaluation via the EVB-LIV3x development kit and X-NUCLEO-GNSS1A1 expansion board, both part of the STM32 Open Development Environment. The modules are supported by the Teseo Suite PC tool, which allows users to configure settings and optimize performance.

The devices are priced from $7.30 in quantities of 1,000. More information is available at www.st.com/gnss-modules.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

Follow on Twitter Follow on Linkedin Visit Website More Content by Brandon Lewis
Previous Article
G.SKILL DDR4 Memory Achieves DDR4-5886 & 23 Overclocking Records During Computex 2019

G.SKILL International Enterprise Co., Ltd. is excited to announce that 23 overclocking records in various b...

Next Article
Wary of Exception Handling in C++?

The Exception Handling System (EHS) in C++ has absolutely nothing to be with exceptions in the sense of bei...