ROHM and GaN Systems are collaborating in the gallium nitride (GaN) power semiconductor business, with the goal of contributing to the continuing evolution of power electronics. The companies have agreed to jointly develop form-, fit-, and function-compatible products using GaN semiconductor dies in both GaN Systems’ GaNPX packaging and ROHM’s traditional power semiconductor packaging. GaN Systems and ROHM will also work together on GaN semiconductor research and development activities to propose solutions for the industrial, automotive, and consumer electronics fields. And to contribute to greater energy savings and increased power densities in the power electronics market, both companies will continue to collaborate to expand their line-up of GaN products and broaden the range of choices.
- Machine Learning
- Power Electronics
- Dev Tools & OS
- Dev Kit Selector
- White Papers
- Upcoming Activities & Events
- embedded world 2020
- Embedded Executive
Western Digital at TU Automotive 2018
Patrick Hopper at the Western Digital Booth at TU Automotive talking with Oded Sagee, Senior Director Embed...
We also recommend:
MYIR Introduces $29 ARM SoM Powered by ST STM32MP1
The MYC-YA157C CPU Module is a powerful and low-cost SoM for various embedded applications.
Highly Improved Technologies to Revolutionize Microdisplay, New Features to Come
Microdisplay has unconventionally benefitted rear-projection TVs, digital cameras, smart bands, smartwatches, smart glasses, and other such gadgets and technologies.
Cadence PCB and SOLIDWORKS CAD Environments Connected by EMA’s CADSync
With native bi-directional traceability and in-tool access to native CAD data structures, engineering teams can easily share high-fidelity design changes and other information that help reduce develo
The Buffer/Driver: What Is It, and Do I Need One?
Although buffers and drivers don’t appear to add functionality to a circuit, these apparently simple interface elements are essential to viable circuit design and operation.
Microway Helps Enable Next-Level Research and Education at Oregon State University
College transforms its GPU resources with new deployment of six DGX-2 systems.
XP Power Announces launch of DC-DC Power Module for Scientific, Semiconductor Applications
XP Power has launched a new DC-DC power module for scientific and semiconductor applications, in a press release.
Characterizing Thermal Performance Through Card Retainers
The ICE-Lok was developed to reduce thermal resistance compared to traditional card retainer clamps, commonly referred to as wedge locks.
Vecow Launches RMS-1000 Series 1U Rackmount In-vehicle Computing System
Vecow announced the release of its RMS-1000 Series, 1U Rackmount fanless in-vehicle Computer System.
Renesas Electronics' High-Efficiency Power Management IC Adopted in Google Coral AI Products
Renesas Electronics, a supplier of semiconductor solutions, announced its ISL91301B Power Management IC (PMIC) is designed into the latest Google Coral products.
VersaLogic Releases Dual Channel CAN Bus Expansion Module in Mini PCIe Format
VersaLogic released the C1 module, an expansion of the companies’ industrial temperature, rugged Mini PCIe products.
Qoitech Approved to Help Companies Launch Low Power, Cellular IoT Devices on AT&T Network
AT&T approved Qoitech as part of its partner program to provide IoT companies assistance in hardware and software design, manufacturing, and device certification.
Industrial Power on Module from AAEON
AAEON, an embedded computing company, released the COM-WHUC6 COM Express module.
Greenliant's NVMe U.2 EnduroSLC Industrial Enterprise SSDs Provide High Performance and Endurance
Greenliant's G7200 NVMe U.2 EX Series industrial enterprise SSDs provide consistent high performance, ultra-robust data retention and ultra-high lifetime endurance of 30 drive writes per day (DWPD).
Red Balloon Security, Atredis Partners Announce Strategic Partnership
The purpose of the partnership is to protect corporations, manufacturers and suppliers against hard to detect firmware-based threats.
Boardcon Releases Idea3288 SBC Features 4G LTE Connectivity for Intelligent Devices
Boardcon has introduced Idea3288 with a more compact structure than EM3288 SBC based on RK3288, a concept the company released in 2016.
Greenliant's High Capacity SLC SATA 2.5" SSDs Provide High Endurance
EnduroSLC Industrial Enterprise SSDs Achieve 30 DWPD for 5 Years.
Introduction to the SPI Interface
This article provides a brief description of the 4-wire SPI interface followed by an introduction to SPI enabled switches and muxes that help reduce the number of digital GPIOs in system board design.
Mobiveil's PCI Express 4.0 Endpoint Controller Passes PCI-SIG Gold and Interoperability Testing
Configurable PCI Express Controller IP Certification Reduces Design Risk, Enables Interoperability with Other PCI Express Products
Microway Provides Vyasa Analytics NVIDIAR DGX-1T and NumberSmasher GPU Server
AI analytics leader enhances scale, develops new capabilities with new deployment.
Newark Introduces Renesas Electronics' RA Family of 32-bit Arm Cortex-M Based MCUs