ROHM and GaN Systems are collaborating in the gallium nitride (GaN) power semiconductor business, with the goal of contributing to the continuing evolution of power electronics. The companies have agreed to jointly develop form-, fit-, and function-compatible products using GaN semiconductor dies in both GaN Systems’ GaNPX packaging and ROHM’s traditional power semiconductor packaging. GaN Systems and ROHM will also work together on GaN semiconductor research and development activities to propose solutions for the industrial, automotive, and consumer electronics fields. And to contribute to greater energy savings and increased power densities in the power electronics market, both companies will continue to collaborate to expand their line-up of GaN products and broaden the range of choices.
Patrick Hopper at the Western Digital Booth at TU Automotive talking with Oded Sagee, Senior Director Embed...
We also recommend:
There are a range of inexpensive single-board computers on the market that can be used for electronic product development.
The new development kit highlights the flexibility of the MAX22515 IO-Link transceiver, all while configuring all modes of the MAX2200 software-configurable analog IO.
Infineon Technologies released the Connected home security evaluation kit with OPTIGA™ Trust M for Raspberry Pi.
TapNLink wins with secure, intuitive NFC 3-Stroke connection for mobiles that eases configuration of HVAC appliances and industrial equipment.
InferX X1P1 PCIe board at $399-$499 brings datacenter class throughput to lower price point edge servers; InferX X1P4 in 2021 will increase throughput 4x
The TrueNAS Open Storage portfolio expanded with the TrueNAS R-Series storage systems and the TrueNAS SCALE Open Source HyperConverged Infrastructure (HCI) software.
The series provides workstation-grade computing capability and providing balance between reliability and power budget for applications of edge computing.
The two companies are developing and will jointly market 650V/50A and 1200V/10A industrial modules.
The Harrier 10x AF-Zoom Camera is now available with LVDS/EX-SDI, USB 3/HDMI and 3G-SDI video output options. With our advanced Harrier technology, it delivers image processing.
Expanded offering allows customers to purchase certified workstations with industrial-grade VR/XR devices.
A sensor device that triggers a certain function when an object is either present or not may sound simple. But in reality, there are numerous factors to consider in order to avoid false positive...
Trying to decide between Off the Shelf and custom hardware? Don't forget to consider these important factors!
Vishay released the Siliconix SiZ240DT, a 40 V n-channel MOSFET half bridge power stage.
InferX X1 offers ideal performance of neural network models such as object detection and recognition, and other neural network models, for robotics, industrial automation, medical imaging, and more.
Leading vendor of advanced USB connectivity ICs/modules FTDI Chip has made Digi-Key Electronics the recipient of its 2020 global distribution award.
Yamaichi has further developed and optimised the Volkswagen standard interface. The mass production has already started.
D3 Engineering announced their DesignCore RS-6843AOP and RS-6843AOPU mmWave Radar Sensors.
Powered by Intel Core i5-7200U processors and Microsoft’s Windows 10 IoT Enterprise operating system, M133K Rugged Tablet PCs can serve as a real-time, cloud connected control point.
The new facility is enabling the company to scale up production of its (Hi-Rel) connectors to meet market requirements.
Companies looking to deliver value in the AIoT marketplace will be faced with extreme design requirements. To succeed, AIoT vendors must carefully consider their entire system design.