Parylene Coating Protects Peltier Elements from Moisture

August 5, 2019 Brandon Lewis

In order to achieve increased protection against environmental influences on printed circuit boards (PCBs), lacquer coatings based on silicone or epoxy resins ­­are often insufficient or prove problematic when applied. The alternative is parylene coating.

The advantage is an even, homogeneous and thin, free of defects, applied protective cover effectively against dust, dirt and moisture. What was only possible in the past for printed circuit boards, is now available from P&N-Europe for Peltier modules. Since TEMs have internally built in rectangular semiconductors (couples), which are very sensitive to humidity, the parylene coating is particularly suitable.

The silicone or epoxy resin sealing at the lateral edges, which is usual with Peltier elements, also offers protection, but despite its insulating effect it represents a thermal bridge between the cold and warm side of the Peltier elements.

For more information, visit www.pn-europe.com.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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