MIPI Completes A-PHY for Long-Reach Automotive Data Transfer

June 4, 2020 Brandon Lewis

The MIPI Alliance has completed the A-PHY v1.0 interface specification for automotive data transfer. A-PHY 1.0 is a long-reach (15 meters) SerDes interface that operates as a point-to-point asymmetric data link. It delivers high-speed unidirectional data, bi-directional control data, and optional power delivery over one cable, eliminating the need for a combination of MIPI C-PHY or D-PHY interfaces, bridges, and proprietary long-reach PHYs in current vehicle networks.

Highlights of the interface include:

  • Data transfer speeds of 2, 4, 8, 12, and 16 Gbps (roadmap to 48 Gbps)
  • Ultra-low 1E-18 packet error rate
  • A PHY layer retransmission system that generates ultra-high EMC immunity

A-PHY will natively support transport protocols such as MIPI CSI-2, MIPI DSI-2, DisplayPort, Embedded DisplayPort, and others. As such, it can be integrated as a complementary interface tot network backbones such as Ethernet, CAN, FlexRay, etc.

The A-PHY v1.0 specification is under member review and expected to be adopted within 90 days. Compliance test suites are already under development.

A webinar outlining the new specification will take place on June 30th. Interested parties can register here: https://www.mipi.org/events/mipi-webinar-a-phy-cornerstone-automotive-system-solution.

For more information, visit mipi.org.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

Follow on Twitter Follow on Linkedin Visit Website More Content by Brandon Lewis
Previous Article
Logic-X Launches the LXD30K0 Analog Interface FMC Module
Logic-X Launches the LXD30K0 Analog Interface FMC Module

The FMC form factor suits both the development of new systems and enables existing host carrier systems to ...

Next Article
New IPC Video Explains Electronics Manufacturing’s Importance in Evocative, People-Centered Language and Imagery
New IPC Video Explains Electronics Manufacturing’s Importance in Evocative, People-Centered Language and Imagery

A new video from IPC shows viewers the many ways “our lives and our communities depend on electronics”