MIPI Alliance Releases Version 2 of SneakPeek Protocol, Opens Debug & Trace Specs to Public

October 4, 2019 Brandon Lewis

The MIPI Alliance has released MIPI SPP v2.0, which introduces the TinySSP protocol for use in high-latency, low-bandwidth interfaces like MIPI I3C. The Alliance has also made nine debug and trace specifications publicly available for download.

MIPI SPP v2.0 replaces debug interfaces between a target and debug test systems, abstracting the interface with address-mapped read-and-write transactions that provide access to a target device’s memory agents. TinySPP reduces the data transfer and overhead of debug and test communicates by using a minimum packet length of just 4 bytes (versus 16 bytes), a byte field of 7 bits, and an addressing system that reduces 64- or 32-bit addresses to 6-bit, where possible.

SPP v2.0 also defines packetized JTAG messaging, which reduces the overhead of JTAG state changes. New opcodes also in FulSPP and TinySPP remove the need for bit-banging. There is also the ability to use a single command to set up polling loops, improving performance for high-latency interfaces.

The publication of these and other specs provides developers with a set of standardized, layered debugging interfaces and protocols. This eliminates the need for dedicated debug and test tools.

The open access specifications include MIPI’s:

MIPI’s software specifications are also available, and provide a standard approach to loading drivers for different components.

For more information visit mipi.org.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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