Laird Releases New Bluetooth 5.1 Module

March 12, 2020 Tiera Oliver

Laird Connectivity released the new BL653 embedded Bluetooth 5.1 module series which enables industrial OEMs to implement longer range BLE applications in the harshest industrial operating environments. The BL653 is a complete multi-protocol embedded wireless offering with processing capability, Bluetooth 5.1 direction finding with angle of arrival (AoA) and angle of departure (AoD), and extended temperature range ideal for challenging RF environments and wireless industrial IoT applications.

Powered by the Nordic nRF52833 silicon, the small form factor BL653 modules and development kits provide a BLE and Cortex-M4F CPU for any OEM's product design. The BL653 provides programming options for the Nordic SDK or Zephyr RTOS, a AT command set, or Laird Connectivity's own smartBASIC environment.

The BL653 series utilizes the nRF52833 hardware features and capabilities including USB access, up to +8 dBm transmit power, and up to 5.5V supply range. In addition to the Bluetooth 5.1 features, the BL653 also has the potential to be Bluetooth 5.2 capable and has hardware support for NFC and 802.15.4 (Thread and Zigbee).

According to the company, the BL653 enables industrial applications previously challenged in supporting wireless connectivity. With Bluetooth meshing capabilities, OEMs can create wireless mesh networks, which extend the reach of messages by relaying them from node to node in a large group of connected devices. Mesh networks are well suited for smart lighting and factory automation applications, which also benefit from the BL653's operating temperature range (up to 105°C). 

The strengths of Bluetooth 5 long range (Coded PHY support) means that Bluetooth signals can travel further and enable wireless communication for constrained, hard-to-reach equipment within factory floors and manufacturing plants. These capabilities of the BL653 now open up industrial equipment such as pumps, valves, and drives for wireless connectivity. The BL653 also boasts robust security, a small footprint, and modular FCC, IC, CE, RCM, MIC, and Bluetooth SIG approvals, which extend to an OEM's design with no new testing for the fastest route to production.

For more information, visit: https://www.lairdconnect.com/

About the Author

Tiera Oliver, edtorial intern for Embedded Computing Design, is responsible for web content edits as well as newsletter updates. She also assists in news content as far as constructing and editing stories. Before interning for ECD, Tiera had recently graduated from Northern Arizona University where she received her B.A. in journalism and political science and worked as a news reporter for the university's student led newspaper, The Lumberjack.

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