Intel Arria 10-based FPGA Prototyping Systems Released by PRO DESIGN

May 7, 2019 Brandon Lewis

MUNICH, GERMANY. PRO DESIGN has added support for Intel Arria A10 GX 1150 FPGAs to its proFPGA portfolio of prototyping systems. Based on motherboard’s that support one (“uno”), two (“duo), or four (“quad”) FPGA modules, engineers can use the systems to easily scale small-to-mid-range IP and SoC verification efforts from 8 million ASIC gates to 32 million ASIC gates using cost-effective Arria 10 FPGA technology.

proFPGA systems allow different types of FPGA modules to be plugged in and mixed easily, with a broad range of FPGA I/O available via as many as 24 extension sites on the new platforms (quad variant). These extension sites are used for FPGA-to-FPGA interconnects or connecting to additional memories, interfaces, application-specific boards, or even multiple proFPGA systems. Point-to-point data transfer rates of up to 1 Gbps are possible through standard I/Os, while 17.4 Gbps can be achieved over high-speed transceivers.

The proFPGA A10 GX 1150 product family is compatible with previous proFPGA generations, allowing existing motherboards, FPGA modules, and other accessories to be used interchangeably across the portfolio. This includes compatibility with high-performance Stratix 10 GX 2800 FPGA modules, which can be mixed and matched in the same system with Arria 10-based devices.

proFPGA systems are bundled with proFPGA Builder software, which includes features such as advanced clock management, integrated self test, automatic board detection, I/O voltage programming, and system scanning. It also enables several developers to use the system in parallel, as well as remote access through Ethernet, USB, or PCIe.

proFPGA uno, duo and quad A10 GX 1150 systems are available now. For more information, visit http://www.profpga.com.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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