Embedded Computing Design's Alix Paultre discussed AIoT, GPGPU, and AI with Joe Lo from Aetina at Embedded World 2019 booth #1-259.
Follow Embedded Computing Design: twitter.com/embedded_comp
Visit Aetina www.aetina.com
We also recommend:
The Royal Air Force and the Invention of the Modern Touchscreen
Believe it or not, the very first touch screen was invented in 1965 in Malvern, England at the Royal Radar Establishment (RRE), a telecommunications research establishment (TRE).
New Vishay Intertechnology Through-Hole Inductor Packs a 420 A Saturation Current into 1500 Case Size
For renewable energy, industrial, and telecom applications, the Vishay Dale IHXL-1500VZ-51 offers low typical DCR down to 0.12 mΩ and continuous high temperature operation to +155 °C.
Embedded Executive: Dipti Vachani, SVP & GM, Automotive and IoT, Arm
A hardware revolution is underway, thanks to software! Is it really? It is according to Dipti Vachani, the Senior Vice President and General Manager of Arm’s Automotive and IoT Lines of Business.
Introducing the first affordable RISC-V board designed to run Linux
BeagleV™, pushes open-source to the next level and gives developers more freedom and power to innovate and design industry leading solutions with an affordable introductory price of $149.
Winmate's Next Generation E430RQ8 Rugged Handheld Computer with Qualcomm Snapdragon 660
Winmate announced their 4.3-inch rugged handheld computer E430RQ8 powered by Qualcomm Snapdragon 660 mobile platform and running on Android 9.0 operating system.
Infineon Launches New Technologies for Acoustical Performance and Power Consumption of MEMS Microphones
This generation MEMS microphone extends the dynamic range of Infineon MEMS mics on both the low and high end.
D3 Engineering Automotive-Grade mmWave Radar Sensor Integrates Antenna Array in 1” Package
The RF front end integrates a PLL, three transmitters, four receivers, and baseband ADC, and allows the sensor to cover up to 4 GHz at a 12 dBm transmit power.
Aspinity Releases EVK2 Development Kit
Aspinity released its Voice-First Evaluation Kit (EVK2), a development kit that demonstrates the company’s ultra-low-power edge processing solution for analog voice activity detection and preroll.
Swissbit Launches CFast Memory Card F-800 for Industrial High-End Applications
The F-800 series is available in various capacities from 2 to 64 GB and is characterized by low power consumption and low heat generation.
Product of the Week: Interface Concept ComEth4510e 40 GbE 6U OpenVPX Managed Layer 2+/3 Switch
The Marvel Prestera-based ComEth4510e delivers support for up to 98 ports with 1000BASE-T SFP+ and QSFP interfaces on the front panel and 1000BASE-KX/10GBASE-KR and 40GBASE-KR4 interfaces on the rear.
MagnaChip Introduces First Power Management IC for Laptops with UHD Display Panels
MagnaChip Semiconductor announced a new line of power management integrated circuits (PMIC) by introducing its first UHD display panel PMIC for laptops.
Investment Protection and Scalability with COM-HPC
“One of the major advantages of the COM-HPC architecture is that you can share the same module and use it across different applications,” offers Joel Finkel of Intel.
Introduction to COM-HPC
The beauty of an open standard like COM-HPC is that it’s interchangeable between different vendors and also between different technologies,” says Christian Eder, congatec.
COM-HPC Carrier Design Considerations
“By using this computer and module philosophy, you end up with a very flexible system," said Chris Engels of Avnet Integrated. "The result is a system that’s widely usable over a long period of time."
Delivering Bleeding Edge Power and Performance
An interview with Burrell Best of Samtec, an overview of the signal integrity and platform integrity subgroup activities enabling COM-HPC.
The Journey to COM-HPC Client
The COM-HPC specification consists of two basic components, the server and the client. Here, I’m going to focus on the client side by referencing a recent interview with Max Chi of Advantech.
COM-HPC Server Modules
The new PICMG COM-HPC specification includes both client and server implementations. Here, I look at the server side based on an interview with ADLINK Technology, Inc.
Specification Development Processes - COM-HPC and Others
With technologies like Gen 5 PCI Express (32 Gtransfers/s) and 5G on the horizon, the time is right for a new COM spec, and COM-HPC is, in essence, an upgrade to—but not a replacement for—COM Express.
Heterogeneous Computing on COM-HPC
Jens Hagemeyer and Martin Kaiser, a pair of research associates at Bielefeld University in Germany, discuss platform management for COM-HPC.
New 60W Laser Cutting and Engraving Machine: Unboxing and Initial Impressions
Perhaps you’ve considered a laser as well, but have little to no idea of what to expect. Overall, I’m happy with my purchase, and there were no huge (bad) surprises.