Digi XBee Cellular adds LTE Cat 1, Cat-M, and NB-IoT support

September 7, 2017 Brandon Lewis

Digi International has released three new cellular modems in its XBee product family that individually support LTE Cat 1, LTE-M, and NB-IoT. The new XBee Cellular modems also include significant upgrades in terms of manageability, programmability, security, Bluetooth Low Energy (BLE)/Bluetooth Mesh, and USB support.

The Digi XBee Cellular gen 2 modem is designed to support AT&T Cat 1 cellular networks, while Digi XBee Cellular LTE-M provides Category-M connectivity for devices migrating from 2G networks. Digi XBee Cellular NB-IoT extends the product line into the low-power, wide-area networking space.

“Fully pre-certified across key carriers, our next-generation Digi XBee Cellular smart modems deliver a platform offering complete design freedom for cellular IoT connectivity integration, from LTE Cat 1 all the way to LTE-M and NB-IoT LPWAN technology,” said Mike Rohrmoser, senior director of product management for embedded systems at Digi International.

The upgraded programmability features of the new XBee modems provide local intelligence on the modems themselves. This functionality can be extracted via rules engine and application logic to control local hardware or manage cellular and short-range wireless links.

Enhanced manageability supports over-the-air (OTA) firmware upgrades by way of the Digi XCTU RF management and configuration tool and the Digi Remote Manager.

Digi TrustFence provides built-in device security.

The Digi XBee Cellular LTE-M modem is available as part of the Arrow LTE-M Starter Kit. For further information on the XBee platform family as a whole, visit www.digi.com/pr/digi-xbee-cellular.



About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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