BOPLA to Appear at embedded world 2019

January 11, 2019 Laura Dolan

BOPLA will be appearing at embedded world from February 26 - 28 in Nuremberg in hall 3, booth 3-155 exhibiting its integration of displays and touchscreens into industrial embedded applications.


BOPLA’s developed casting technology is used for their integration into standard or customer-specific electronic housing, achieving optical bonding with the functionality of the individually designed user interfaces, supporting the technology for the combination of touch and glass units. They also offer particle-free assembly of optical, electronic or precision mechanical components for specific requirements.

BOPLA also offers printing, laser marking and cable assembly in addition to quality testing. 

For more information, visit

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