BOPLA to Appear at embedded world 2019

January 11, 2019 Laura Dolan

BOPLA will be appearing at embedded world from February 26 - 28 in Nuremberg in hall 3, booth 3-155 exhibiting its integration of displays and touchscreens into industrial embedded applications.


 

BOPLA’s developed casting technology is used for their integration into standard or customer-specific electronic housing, achieving optical bonding with the functionality of the individually designed user interfaces, supporting the technology for the combination of touch and glass units. They also offer particle-free assembly of optical, electronic or precision mechanical components for specific requirements.

BOPLA also offers printing, laser marking and cable assembly in addition to quality testing. 

For more information, visit www.bopla.de.

Previous Article
PLS’ Latest Version of UDE 5.0 Hits the Market

PLS Programmable Logic & Systems has released the latest version of its Universal Debug Engine 5.0 for prof...

Next Article
New OpenVPX Chassis Platform from Pixus Features Multiple Segments
New OpenVPX Chassis Platform from Pixus Features Multiple Segments

Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers a 4U OpenVPX chass...