Arm Debuts eMRAM IoT test chip with Samsung, Cadence

May 15, 2019 Brandon Lewis

SAMSUNG FOUNDRY FORUM. Arm, Samsung Foundry, Cadence, and Sondrel have collaborated on the Musca-S1, a 28 nm fully-depleted silicon-on-insulator (FD-SOI) embedded MagnetoResistive RAM (eMRAM) test chip based on Arm Cortex-M33 IP. The Musca-S1 test chip and an accompanying development board enable IoT SoC designers to evaluate eMRAM technology, which can easily scale below 40 nm to support a broad range of memory and power requirements.

The Musca-S1 test chip combines on-chip power control, eMRAM non-volatile memory power shutdown, and Samsung’s FD-SOI body biasing process for highly energy-efficient IoT device prototyping. The IP was implemented using Cadence Verification Suite and DFM signoff tools.

The chip has been certified to Level 1 of Arm’s Platform Security Architecture, integrating Arm CryptoCell-300 technology, Arm Coresight, Arm TrustZone, and Trusted Firmware-M (TF-M). The test chip is capable of running Arm’s Mbed OS, while device and data management capabilities can be tested using Arm’s Pelion IoT platform.

The Musca-S1 test chip and accompanying development board will be available in limited quantities beginning in Q3 2019.

More information is available at www.arm.com/products/development-tools/development-boards/musca-a1-iot.

 

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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